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| Flexible Hybrid Electronics: Manufacturing Flexible Electronics by Printing Technique |
| CUI Zheng
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| Institute of Nanotech and Nanobionics,Chinese Academy of Sciences,Suzhou 215123,China |
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Abstract The commercialization of foldable mobile phones makes the year of 2019 been regarded as the starting year of flexible electronics. However, apart from the flexible displays which contribute to the foldable phones, flexible electronics products in a broader sense still remains unrea-lized. One of the key reasons is not all the functional electronic components have been successively flexibilized in commercial level. For example, there are still no flexible alternatives for the transistors and integrated circuits (ICs) which are indispensable to any electronic system. And the complete functions of an electronic system still rely on rigid IC chips and printed circuit boards (PCBs). To overcome this barrier, no other choice is practicable except fabricating flexible electronic systems that integrate traditional rigid ICs. There are currently two approaches to achieving this integration — transferring thin silicon chips onto a flexible substrate; or the so called “flexible hybrid electronics” — in which the latter is based on printing technique and is of simplicity, low cost and high throughput potential. Herein, I sketch out the technical approach of flexible hybrid electronics, and give a summary of the research progress of the ink materials and printing process for flexible electronics printing manufacturing. In addition, I also present a retrospective report showing the achievements of the author's Printable Electronics Research Center in the last 10 years in the area of printed electronics. This paper intends to prove that we can create flexible electronic products closer to practical applications and more competitive through printing conductive interconnects on flexible substrates, which can be an effective methodology, at the current technology level, to greatly advance the commercialization of flexible electronics.
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Published: 15 January 2020
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| About author:: Zheng Cui received Ph.D degree in electronic engineering in 1988, worked in Cambridge University and Rutherford Appleton Laboratory in the UK from 1989 to 2009, joined the Suzhou Institute of Nanotech and Nanobionics since October 2009 and founded the Prin-table Electronics Research Center there. In the last10 years, the Center has conducted research in organic/inorganic electronic inks, printed electronics processes, printed solar cells, printed thin-film transistors, printed organic and quantum dots light emission, printed flexible/stretchable/wearable electronics, and encapsulation of organic electronics. He has authored and co-authored over 250 technical papers, 8 books in the areas of micro/nanofabrication and printed electronics. The patent “Patterned flexible transparent conductive films and method of manufacturing” which he was the leading inventor won the 16th Outstanding Chinese Patent Award. |
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2020, Vol. 34 
