INORGANIC MATERIALS AND CERAMIC MATRIX COMPOSITES |
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Interfacial Wetting in Inkjet Printing |
NING Honglong, ZHU Zhennan, CAI Wei, WEI Jinglin, ZHOU Shangxiong, TAO Ruiqiang, CHEN Jianqiu,LIU Xianzhe, YAO Rihui, PENG Junbiao
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State Key Laboratory of Luminescent Materials and Devices, Institute of Polymer Photoelectric Materials and Devices, School of Materials Science and Enginee-ring, South China University of Technology,Guangzhou 510640 |
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Abstract Recently, printing electronic has attracted wide attention for its low cost, low energy consumption and simple process, which shows promising application prospect in microelectronics manufacturing. Inkjet printing is one of the most important methods of printing electronics allowing editing patterns through computer programming, which has always been a hot pot of research for its high speed and flexibility compared with vacuum process. During inkjet printing, deposition of ink on substrate involves interfacial wetting between ink and nozzle and between ink and substrate so that wetting can significantly affect graphing and function of printing patterns. From the aspect of interface, wetting in inkjet printing mainly refers to wetting between ink and substrate; from the aspect of surface, wettabilities of ink and substrate are two main issues of wetting in inkjet printing. One of the two issues is investigated to achieve expected printing results in general. Researches show that wettability of ink can evidently affect droplet jetting behavior, printing resolution and printing morphology, while wettability of substrate mainly affects quality of printing pattern graphing. By adjusting components of ink and substrate, surface tension of ink and surface free energy of substrate can be significantly adjusted. For substrate, it is also effective to make it under different kinds of surface treatment to change its surface physical or chemical structure, and thus change its surface free energy, or make its different regions obtain different wettabi-lities, which achieves special printing results by limitation of ink on particular region. In this review, recent progress in wetting of inkjet printing has been summarized and effect of interfacial wetting on printing results has been demonstrated from aspects of ink wettability and substrate wettability. Important questions such as printing resolution and morphology modulation have been proposed and characteristics and advantages of each methods have been discussed. As higher integration is demanded, it is sure that printing resolution needs to be further improved. As such an important role wettability plays in inkjet printing patterning, it still remains a challenge and opportunities.
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Published: 15 August 2019
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About author:: Honglong Ning (1971—) was born in Zhuzhou, Hunan province. He is a professor of China South University of Technology. He received Ph.D. in electronic material & packaging from Tsinghua University in 2004. Rihui Yao (1981—) was born in Lianyuan, Hunan province. He is an associate professor in South China University of Science and Technology.He got his Ph.D. in Zhongshan University in 2008. |
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Perelaer J, Smith P J, Mager D, et al. Journal of Materials Chemistry,2010,20(39),8446.2 Hyun W J, Secor E B, Hersam M C, et al. Advanced Materials,2015,27(1),109.3 Dong X F, Zhu N. Mechine Tool and Hydraulics,2017,45(18),111 (in Chinese).董雪峰,朱宁.机床与液压,2017,45(18),111.4 Garnier F, Hajlaoui R, Yassar A, et al. Science,1994,265(5179),1684.5 Singh M, Haverinen H M, Dhagat P, et al. Advanced Materials,2010,22(6),673.6 Hoth C N, Schilinsky P, Choulis S A, et al. Nano Letters,2008,8(9),2806.7 Sridhar A, Blaudeck T, Baumann R R. Material Matters,2011,6(1),12.8 Han X G, Cui L X, Wang W Q, et al. Mechine Tool and Hydraulics,2017,45(18),70(in Chinese).韩兴国,崔立秀,王为庆,等.机床与液压,2017,45(18),70.9 Basaran O A, Gao H, Bhat P P. Annual Review of Fluid Mechanics,2013,45(45),85.10 Wijshoff H. Physics Reports,2010,491(4),77.11 Roth E A, Xu T, Das M, et al. Biomaterials,2004,25(17),3707.12 Gennes P G D. Review of Modern Physics,1985,57(3),827.13 Choi K H, Rahman A, Ko J B, et al. International Journal of Advanced Manufacturing Technology,2010,48(1-4),165.14 Kim Y J, Choi J, Sang U S, et al. Japanese Journal of Applied Physics,2010,49(6),1212.15 He B, Yang S, Qin Z, et al. Scientific Reports,2017,7(1),11841.16 Karpitschka S, Riegler H. Physical Review Letters,2012,109(6),66103.17 Tekin E, de Gans B, Schubert U S. Journal of Materials Chemistry,2004,14(17),2627.18 Kosmala A, Wright R, Zhang Q, et al. Materials Chemistry & Physics,2011,129(3),1075.19 Liu M, Wang J, He M, et al. ACS Applied Materials & Interfaces,2014,6(16),13344.20 Li J, Ye F, Vaziri S, et al. Advanced Materials,2013,25(29),3985.21 Deegan R D, Bakajin O, Dupont T F, et al. Nature,2012,389(6653),827.22 Deegan R D, Bakajin O, Dupont T F, et al. Physical Review E,2000,62(1),756.23 Deegan R D. Physical Review E,2000,61(1),475.24 Eom S H, Park H, Mujawar S H, et al. Organic Electronics,2010,11(9),1516.25 Park S J, Lee E J, Kwon S H. Bulletin-Korean Chemical Society,2007,28(28),188.26 Wan Y, Lou J, Xu J, et al. In: IEEE 2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale(3M-NANO). Suzhou, China,2013,pp.97.27 Xu Z. IET Science, Measurement & Technology,2014,9(1), 113.28 Tracton A A. Coatings technology handbook,CRC Press, Boca Raton,2005.29 David S, Sefiane K, Tadrist L. Colloids & Surfaces A: Physicochemical & Engineering Aspects,2007,298(1-2),108.30 Bourgesmonnier C, Shanahan M E R. Langmuir,1995,11(7),2820.31 Pietrikova A, Lukacs P, Jakubeczyova D, et al. Circuit World,2016,42(1),9.32 Lessing J, Glavan A C, Walker S B, et al. Advanced Materials,2014,26(27),4677.33 Van Osch T H J, Perelaer J, de Laat A W M, et al. Advanced Materials,2010,20(2),343.34 Morra M, Occhiello E, Garbassi F. Journal of Colloid & Interface Science,1989,132(2),504.35 Morra M, Occhiello E, Garbassi F. Langmuir,1989,5(3),872.36 Park Y, Lee J, Chung I, et al. Japanese Journal of Applied Physics,1999,38(5B),L577.37 Gokus T, Nair R R, Bonetti A, et al. ACS Nano,2009,3(12),3963.38 Morent R, Geyter N D, Leys C. Nuclear Instruments and Methods in Physics Research B,2008,266(12-13),3081.39 Kaplan S L, Rose P W, Nguyen H X, et al. Materials-Pathway to the Future,1988,19(4),55.40 Lai J, Sunderland B, Xue J, et al. Applied Surface Science,2006,252(10),3375.41 Nguyen P Q, Yeo L P, Lok B K, et al. ACS Applied Materials & Interfaces,2014,6(6),4011.42 Mohanty S, Ylitalo C, Woo O S. Langmuir,2004,20(6),2277.43 Ely F, Avellaneda C O, Paredez P, et al. Synthetic Metals,2011,161(19-20),2129.44 McDonald J C, Whitesides G M. Accounts of Chemical Research,2002,35(7),491.45 Packham D E. International Journal of Adhesion & Adhesives,2003,23(6),437.46 Cruz S, Rocha L A, Viana J C. Applied Surface Science,2016,360,198.47 Huang L, Huang Y, Liang J, et al. Nano Research,2011,4(7),675.48 Lim J A, Cho J H, Jang Y, et al. Thin Solid Film,2006,515(4),2079.49 Kim C, Nogi M, Suganuma K, et al. ACS Applied Materials & Interfaces,2012,4(4),2168.50 Yeo L P, Lok B K, Nguyen Q M P, et al. International Journal of Advanced Manufacturing Technology,2014,71(9-12),1749.51 Wang J Z, Zheng Z H, Li H W, et al. Nature Materials,2004,3(3),171.52 Kawase T, Shimoda T, Newsome C, et al. Thin Solid Film,2003,438,279.
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