电子封装用纳米级无铅钎料的研究进展

doi:10.11896/cldb.23080181

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Abstract With the continuous development of the electronics industry, packaging technology presents the development trend of multi-function, high density and high integration. The solder joint plays an important interconnection between chip and substrate, faces great challenges in strength and reliability. In recent years, with the rise of nanotechnology, many researchers tried to reduce the size of soldering materials to nanometer level for modification. The investigations show that the thermal stability, conductivity, wettability and other properties of the nanoscale sol-ders are improved in different degrees compared with the conventional solders. In this work, several preparation methods of nano-brazing metal which have been widely used in recent years are summarized and the preparation process of nano-brazing metal dominated by chemical reduction method is emphatically analyzed, by analyzing the microstructure evolution of SnAgCu, SnAg, SnBi and Ag-sintered solder, the modification mechanism summarized. Finally the problems that are difficult to break through in the field of solder nanocrystallization and the shortcomings are discussed, which can provide theoretical support for further research of nanoscale lead-free solders.

Key words： electronic packaging nanoscale solders preparation technology modification mechanism

Published: 10 December 2024 Online: 2024-12-10

CLC number:

TG42

Fund:High Level Talent Research Initiation Project of Xiamen University of Technology (YKJ22054R) and Fujian Provincial “Minjiang Scholar” Distinguished Professor Talent Plan Project.

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	HUANG Xi
	ZHANG Liang
	WANG Xi
	CHEN Chen
	LU Xiao

Cite this article:

HUANG Xi,ZHANG Liang,WANG Xi, et al. Research Progress of Nanoscale Lead-free Solder in Electronic Packaging[J]. Materials Reports, 2024, 38(23): 23080181-13.

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http://www.mater-rep.com/EN/10.11896/cldb.23080181 OR http://www.mater-rep.com/EN/Y2024/V38/I23/23080181

1 Jiang N, Zhang L, Xiong M Y, et al. Materials Reports, 2019, 33(23), 3862 (in Chinese).
姜楠, 张亮, 熊明月, 等. 材料导报, 2019, 33(23), 3862.
2 Zhang L, Tu K N, Chen X W, et al. Sci Sin Tech, 2016, 46(8), 767 (in Chinese).
张亮, TU King Ning, 陈信文, 等. 中国科学: 技术科学, 2016, 46(8), 767.
3 Kim K S, Huh S H, Suganuma K. Microelectronics Reliability, 2003, 43(2), 259.
4 Umair Ali, Hamza Khan, Muhammad Aamir, et al. Metals, 2021, 11(7), 1077.
5 Dieter Vollath, Franz Dieter Fischer, David Holec. Beilstein Journal of Nanotechnology, 2018, 9, 2265.
6 Wu Z Y, Yang X L, Wang Z. Nanotechnology, 2019, 30(24), 245601.
7 Grégory Guisbiers, Rubén Mendoza-Cruz, Lourdes Bazán-Díaz, et al. ACS Nano, 2016, 10(1), 188.
8 Grégory Guisbiers, Rafael Mendoza-Perez. Nanotechnology, 2020, 31(29), 295702.
9 Sundaram D S, Yang V, Zarko V E. Combustion, Explosion, and Shock Waves, 2015, 51, 173.
10 Florent Calvo. Physical Chemistry Chemical Physics, 2015, 42(17), 27922.
11 Zhang W P, Zou C D, Zhao B G, et al. Transactions of Nonferrous Metals Society of China, 2014, 24(3), 750.
12 Zhang W P, Zhao B G, Zou C D, et al. Transactions of Nonferrous Metals Society of China, 2013, 23(6), 1668.
13 Gao Y L, Zhuravlev E, Zou C D, et al. Thermochimica Acta, 2009, 482(1-2), 1.
14 Chee S S, Lee J H. Materials Letters, 2012, 8, 53.
15 Jiang H, Robertson S, Zhou Z, et al. In: 2020 IEEE 8th electronics system-integration technology conference (ESTC), Tønsberg, Norway, 2020, pp.1.
16 Chen J H, Lo S C, Hsu S C, et al. Connection Application. Microma-chines, 2018, 9(12), 644.
17 Liu Q, Dai X F, Zhang T, et al. CIESC Journal, 2021, 72(2), 681(in Chinese).
刘庆, 戴小凤, 张腾, 等. 化工学报, 2021, 72(2), 681.
18 Zhang X, Zhang W, Peng Y. Nanotechnology, 2022, 33, 305301.
19 Zhang X, Zhang H, Zheng X J, et al. Nanotechnology, 2019, 30, 195302.
20 Zhang X. Patent, CN2016111077025, China, 2018(in Chinese).
张悬. 专利, CN2016111077025, 中国, 2018.
21 Yang F, Hang C J, Tian Y H. Electronics & Packaging, 2021, 21(3), 12 (in Chinese).
杨帆, 杭春进, 田艳红. 电子与封装, 2021, 21(3), 12.
22 Wang S, Tian Y H. Materials Science & Technology, 2017, 25(5), 1(in Chinese).
王尚, 田艳红. 材料科学与工艺, 2017, 25(5), 1.
23 Zhang S Y, Xu X Y, Lin T, et al. Journal of Materials Science-Materials in electronics 2019, 30, 13855.
24 Tian Z, Li J P, Du Z G, et al. Sci-Tech Information Development & Economy, 1997, 2, 11(in Chinese).
田震, 李晋平, 杜志刚, 等. 科技情报开发与经济, 1997, 2, 11.
25 Liu C, Cheng H M. New Carbon Materials, 2001, 16(1), 67(in Chinese).
刘畅, 成会明. 新型炭材料, 2001, 16(1), 67.
26 Yang M, Han B B, Ma X, et al. Electronics Process Technology, 2014, 35(1), 1 (in Chinese).
杨明, 韩蓓蓓, 马鑫, 等. 电子工艺技术, 2014, 35(1), 1.
27 Xu H X, Zeiger B W, Kenneth S. Chemical Society Reviews, 2013, 42, 2555.
28 Kang Y K, Kim J, Park S K, et al. Journal of Nanoscience and Nano technology, 2020, 20(5), 3201.
29 Tang Y K, Xu J, Wei L F. Journal of Chongqing University (Natural Science Edition), 2005, 28(1), 5 (in Chinese).
唐一科, 许静, 韦立凡. 重庆大学学报(自然科学版), 2005, 28 (1), 5.
30 Wang Yan. Synthesis of Nano-SnAgCu solder by microemulsion method. Master's Thesis, China Jiliang University, China, 2019 (in Chinese).
王艳, 微乳法合成纳米SnAgCu焊料. 硕士学位论文, 中国计量大学, 2019.
31 Maqsood Ahmad Malik, Mohammad Younus Wani, Mohd Ali Hashim. Arabian Journal of Chemistry, 2012, 5 (4), 397.
32 Sang-Soo Chee, Jong-Hyun Lee. Electronic Materials Letters, 2012, 8, 587.
33 Goia D V. Journal of Materials Chemistry, 2004, 14(4), 451.
34 Murthy I N, Sivaprasad K, Rao J B. International Journal of Engineering, Science and Technology, 2018, 10(3), 17.
35 Barreto K, Lima K L, Manzato T, et al. ABM International Congress, Rio de Janeiro, RJ (Brazil), 2010, 18, 26.
36 Milea A, Gingu O, Preda S, et al. Journal of Alloys and Compounds, 2015, 629(25), 214.
37 Tseng K H, Lin Y S, Lin Y C, et al. Nanomaterials, 2020, 10(6), 1091.
38 Zou C D, Gao Y L, Yang B, et al. Journal of Electronic Materials, 2009, 38, 351.
39 Prem Ranjan, Duy Hieu Nguyen, Kenta Tanaka, et al. Applied Nanoscience, 2019, 9, 341.
40 Yu X, Di T T, Shen H Y. Chinese Journal of Materials Research, 2020, 34(4), 299 (in Chinese).
俞鑫, 邸彤彤, 沈杭燕. 材料研究学报, 2020, 34(4), 299.
41 Salomeh Tabatabaei, Ashavani Kumar, Haleh Ardebili, et al. Microelectronics Reliability, 2012, 52(11), 2685.
42 Qi M M, He X B, Liu S B, et al. Transactions of the China Welding Institution, 2022, 43(7), 97 (in Chinese).
齐苗苗, 贺晓斌, 刘双宝, 等. 焊接学报, 2022, 43(7), 97.
43 Cao Y, Liu P, Wei H M, et al. Journal of Materials Engineering, 2015(4), 79 (in Chinese).
曹洋, 刘平, 魏红梅, 等. 材料工程, 2015(4), 79.
44 Delsante S, Novakovic R, Borzone G. Journal of Alloys and Compounds, 2018, 747(30), 385.
45 Ali Roshanghias, Jan Vrestal, Andriy Yakymovych, et al. CALPHAD, 2015, 49, 101.
46 Yung K C, Law C M T, Lee C P, et al. Journal of Electronic Materials, 2012, 41, 313.
47 Li-Yin Hsiao, Jenq-Gong Duh. Journal of the electrochemical society, 2005, 105, 152.
48 Jiang H J, Moon K, Hua F, et al. Chemistry of Materials, 2007, 19(18), 4482.
49 Yang Ju, Takafumi Tasaka, Hayato Yamauchi, et al. Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, 2015, 21, 1849.
50 Frongia F, Pilloni M, Scano A, et al. Journal of Alloys and Compounds, 2015, 623 (25), 7.
51 Lin C Y, Mohanty U S, Chou J H, et al. Journal of Alloys and Compounds, 2010, 501(2), 204.
52 Koppes J P, Grossklaus K A, Muza A R, et al. Materials Science and Engineering B, 2012, 177(2), 197.
53 Li Junjie. Research on Cu based nanosolders for low temperature Cu-Cu bonding. Ph. D. thesis, Huazhong University of Science and Technology, China, 2017 (in Chinese).
李俊杰. 面向低温 Cu-Cu 键合的Cu基纳米焊料研究. 博士学位论文, 华中科技大学, 2017.
54 Ao Y W, Yang Y X, Yuan S L, et al. Materials Chemistry and Physics, 2007, 104(1), 158.
55 Jiang H J, Moon K, Wong C P. Microelectronics Reliability, 2013, 53(12), 1968.
56 Wang H S, Qiao X L, Chen J, et al. Materials Chemistry and Physics, 2005, 94(2-3), 449.
57 Chih Y W, Cheng W T. Materials Science and Engineering: B, 2007, 145(1-3), 67.
58 Qiu J, Zhou G Y, He W, et al. Electronic Components and Materials, 2021, 40(11), 1060 (in Chinese).
邱娟, 周国云, 何为, 等. 电子元件与材料, 2021, 40(11), 1060.
59 Wang B, Li W Y, Zhang S Y, et al. Journal of Materials Science, 2022, 57, 17533.
60 Wang M, Yuan M, Wang C M, et al. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2020, 602(5), 125083.
61 Yang S, Rajathurai K, Fan G, et al. Journal of Alloys and Compounds, 2015, 626(25), 391.
62 Hao H, Ding M. Metals and Materials International, 2022, 28, 1981.
63 Wu M, Lv B L. Acta Electronica Sinica, 2016, 44(1), 222 (in Chinese).
吴敏, 吕柏林. 电子学报, 2016, 44(1), 222.
64 Arenas M F, He M, Acoff V L. Journal of Electronic Materials, 2006, 35, 1530.
65 Xu D X, Lei Y P, Xia Z D, et al. Journal of Electronic Materials, 2008, 37, 125.
66 Zeng G, Xue S, Zhang L. et al. Journal of Materials Science-Materials in Electronics, 2010, 21, 421.
67 Sopousek J, Vrestal J, Zemanova A, et al. Journal of Mining and Metallurgy Section B: Metallurgy, 2012, 48(3), 419.
68 Joonho Lee, Toshihiro Tanaka, Junggoo Lee, et al. CALPHAD, 2007, 31(1), 105.
69 Luca Pavan, Francesca Baletto, Rada Novakovic. Physical Chemistry Chemical Physics, 2015, 17, 28364.
70 Simona Delsante, Gabriella Borzone, Rada Novakovic. Physical Chemistry Chemical Physics, 2015, 17, 28387.
71 Kijoo Sim, Joonho Lee. Journal of Alloys and Compounds, 2014, 590(25), 140.
72 Joonho Lee, KiJoo Sim. CALPHAD, 2014, 44, 129.
73 Delsante S, Novakovic R, Borzone G. Journal of Alloys and Compounds, 2018, 747(30), 385.
74 Buffat P, Borel J P. Physical Review A, 1976, 13(6), 2287.
75 Kijoo Sim, Joonho Lee. Journal of Alloys and Compounds, 2014, 590(25), 140.
76 Li-Yin Hsiao, Jenq-Gong Duh. Journal of the electrochemical society, 2005, 105, 152.
77 Yang Ju, Takafumi Tasaka, Hayato Yamauchi, et al. Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, 2015, 21, 1849.
78 Fang Min gang, Tang Chu, Chen Yi ming, et al. Journal of Materials Science: Materials in Electronics, 2022, 33 (13), 10471.
79 Lu Xiao, Zhang Liang, Xi Wang, et al. Journal of Materials Science: Materials in Electronics, 2022, 33 (29), 22668.
80 Shen Yu an. JOM, DOI:10.1007/s11837-023-06079-9.
81 Jiang H, Moon K, Hua F, et al. Chemistry of Materials, 2007, 19(18), 4482.
82 Zou C D, Gao Y L, Yang B, et al. Journal of Materials Science-Materials in Electronics, 2010, 21, 868.
83 Tran Thai Bao, Yunkyum Kim, Joonho Lee, et al. Materials Transactions, 2010, 51(12), 2145.
84 Chukka R N, Telu S, Bhargava N R M R, et al. Journal of Materials Science: Materials in Electronics, 2011, 22, 281.
85 Ali Roshanghias, Jan Vrestal, Andriy Yakymovych et al. CALPHAD, 2015, 49, 101.
86 Ali Roshanghias, Andriy Yakymovych, Johannes Bernardi, et al. Nanoscale, 2015, 7, 5843.
87 Zou C D, Gao Y L, Yang B, et al. Journal of Materials Science: Materials in Electronics volume, 2012, 23, 2.
88 Gao Y L, Zou C D, Yang B, et al. Journal of Alloys and Compounds. 2009, 484(1-2), 777.
89 Mulugeta Abtew, Guna Selvaduray. Materials Science and Engineering: R: Reports, 2000, 27(5-6), 95.
90 Li Song. Wetting dynamics of solders in SMT. Ph. D. thesis, Huazhong University of Science and Technology, China, 2008 (in Chinese).
李松. 电子封装焊料润湿性的研究. 博士学位论文, 华中科技大学, 2006.
91 Voinov O V. Fluid Dynamics, 1976, 11, 714.
92 Voinov O V. Journal of Applied Mechanics and Technical Physics, 1999, 40, 86.
93 Cox R G. Journal of Fluid Mechanics, 1986, 168, 169.
94 Hwang J S. Solder Paste in Electronics Packaging, Springer, New York, 2012, pp.52.
95 Zhang Xuan. Synthesis, characterization and nanosoldering application of SnCu-based nanosolders. Ph. D. thesis, Lanzhou University, China, 2019 (in Chinese).
张悬. 锡铜系纳米焊料制备、表征及纳米焊接应用. 博士学位论文, 兰州大学, 2019.
96 Yin L M, Zhang Z G, Su Z L, et al. Journal of Electronic Materials, 2020, 49, 7394.
97 Ali Roshanghias, Golta Khatibi, Andriy Yakymovych, et al. Journal of Electronic Materials, 2016, 45, 4390.
98 Du W, Qiang J F, Yu Z H, et al. Materials Reports, 2023, 37(19), 22010113 (in Chinese).
杜伟, 强军锋, 余竹焕, 等. 材料导报, 2023, 37(19), 22010113.
99 Wu W Z, Yang F, Hu B, et al. Transactions of the China Welding Institution, 2021, 42(1), 83 (in Chinese).
吴炜祯, 杨帆, 胡博, 等. 焊接学报, 2021, 42(1), 83.
100 Yu Chunyu, Yang Dongsheng, Zhao Donglei, et al. In: 20th international conference on electronic packaging technology (ICEPT), Hong Kong, China, 2019, pp.1-4.
101 Kim J C, Ren Z Q, Yuksel A, et al. Journal of Electronic Packaging, 2021, 143(1), 10801.
102 Ancang Yang, Yonghua Duan, Caiju Li, et al. Intermetallics, 2022, 141, 107437.
103 Bai J G, Zhang Z Z, Calata J N, et al. IEEE Transactions on Components and Packaging Technologies, 2013, 29, 58.
104 Zhang Hong. Design andcharacterization of 1D Sn-based nanosolders & its applications. Ph. D. thesis, Lanzhou University, China, 2016 (in Chinese).
张宏. 纳米焊料的制备、微/纳表征及纳米焊接应用. 博士学位论文, 兰州大学, 2016.
105 Sharma M K, Qi D , Raymond D. AIChE Journal, 2016, 62 (2), 408.
106 Luc W, Collins C, Wang S, et al. Chemical Society Reviews, 2017, 139(5), 1885.
107 Zhang G P, Li M L, Wu X M, et al. Chinese Journal of Materials Research, 2014, 28(2), 81 (in Chinese).
张广平, 李孟林, 吴细毛, 等. 材料研究学报, 2014, 28(2), 81.
108 Jiang N, Zhang L, Xiong M Y, et al. Electronic Components and Materials, 2019, 38(8), 1 (in Chinese).
姜楠, 张亮, 熊明月, 等. 电子元件与材料, 2019, 38(8), 1.
109 Jing H, Heng C, Zhou M, et al. Journal of Electronic Materials, 2023, 52, 1216.
110 Wang Di. On resistance of nano-Ag-Pd paste toelectrochemical migration behavior at high temperatures. Master's Thesis, Tianjin University, China, 2017 (in Chinese).
王迪. 高温环境下纳米Ag-Pd焊膏的抗电化学迁移老化行为研究. 硕士学位论文, 天津大学, 2017.
111 Morisada Y, Nagaoka T, Fukusumi M, et al. Journal of Electronic Materials, 2010, 39, 1283.
112 Yu S P, Lin H J, Hon M H, et al. Journal of Materials Science: Materials in Electronics, 2000, 11, 461.
113 Zhang X D, Hu X D, Jiang X X, et al. Applied Physics A, 2018, 315, 124.
114 Hu X W, Qiu H Y, Jiang X X. Journal of Materials Science: Materials in Electronics, 2019, 30, 1907.
115 Ma Haoran, Anil Kunwar, Huang Ru, et al. Intermetallics, 2017, 90, 90.
116 Wu Min, Lv Bailin. Journal of Electronic Materials, 2016, 45, 38.
117 Roshanghias A, yakymovych A, Bernardi J, et al. Nanoscale, 2015, 7, 5843.
118 Zhang H, Zhang J W, Lan Q Q, et al. Nanotechnology, 2014, 25, 425301.
119 Frongia F, Pilloni M, Scano A, et al. Journal of Alloys and Compounds, 2015, 623 (25), 7.
120 Zhang S Y, Chu Y F, Li Z F, et al. Materials Reports, 2023, 37(15), 125 (in Chinese).
张墅野, 初远帆, 李振锋, 等. 材料导报, 2023, 37(15), 125.
121 Wang T, Wang C, Fang H, et al. In: 20th international conference on electronic packaging technology (ICEPT), Hong Kong, China, 2019, pp.1.
122 Sun Y, Lu X, Zhang Q, et al. In: 20th International Conference on Electronic Packaging Technology(ICEPT), Hong Kong, China, 2019, pp.1.
123 Yang W C, Hu S W, Zhu W B, et al. Transactions of the China Welding Institution, 2022, 43(11), 137(in Chinese).
杨婉春, 胡少伟, 祝温泊, 等. 焊接学报, 2022, 43(11), 137.
124 Dong H W, Zhang G X, Dong X, et al. Materials Reports, 2021, 35(S2), 341 (in Chinese).
董宏伟, 张冠星, 董显, 等. 材料导报, 2021, 35(S2), 341.
125 Xia W J, Feng X J, Hu Y, et al. Aerospace Materials & Technology, 2021, 51(6), 71 (in Chinese).
夏维娟, 冯晓晶, 胡媛, 等. 宇航材料工艺, 2021, 51(6), 71.

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