INORGANIC MATERIALS AND CERAMIC MATRIX COMPOSITES |
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Simulation of Vibration Intensity Distribution of SiC Ceramic Surface Under Ultrasonic |
MA Zhipeng1,2, ZHANG Mingxuan1, YU Haiyang1, XU Zhiwu2, YAN Jiuchun2
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1 Department of Materials Science and Engineering, Northeast Petroleum University, Daqing 163318, China 2 State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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Abstract The transient analysis and harmonic response analysis of SiC ceramics under ultrasonic action were performed using ANSYS finite element simulation software. The vibration intensity and vibration distribution of SiC ceramic surface under ultrasonic action were investaged by the laser vibrometer. The results show that the ultrasonic vibration of the SiC ceramic surface spreads around the ultrasonic tool head after the application of ultrasonic. The vibration intensity distribution of the SiC ceramic surface changes rapidly. The vibration first reaches the three boundaries closer to the ultrasonic tool head, and then reaches the farther boundary. With the increase of ultrasonic time, the vibration of SiC ceramics reaches a steady state of harmonic response. The vibration intensity of SiC ceramic surface increases with the increase of ultrasonic amplitude. When the ultrasonic amplitude is 4 μm, the amplitude of the ceramic surface vibration intensity can reach 18.6 μm in one period. When the ultrasonic amplitude is 8 μm, the vibration intensity amplitude is 36.6 μm. After the application of ultrasonic, the vibration intensity of the SiC ceramic surface is on the horizontal centerline, which gradually increases along the right edge of the ultrasonic tool head, and gradually increases along the horizontal centerline toward the two boundaries. Under the action of ultrasonic, the vibration at the center of the ultrasonic tool head on the ceramic surface is sinusoidal. In the direction away from the tool head, the vibration is no longer sinusoidal, but it also shows some characteristics of sinusoidal fluctuation. The vibration distribution characteristics and propagation law of SiC ceramic surface under the action of ultrasonic were analyzed. It can help to grasp the bonding method and mechanism of ultrasonic-assisted brazing of SiC ceramics, which makes the application of ultrasonic technology in SiC ceramic brazing possible.
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Published: 06 November 2020
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Fund:National Natural Science Foundation of China (51674090). |
About author:: Zhipeng Maobtained his Ph.D. degree from Harbin Institute of Technology (HIT) in Nov. 2011. He is currently a professor and doctoral supervisor of the Northeast Petroleum University (NEPU). He performed collaborative research in 2017—2018 in CCWJ (Canadian Centre for Welding+Joining), University of Alberta. He has published more than 20 journal papers, applied 13 national invention patents and 11 of them were authorized. His team’s research interests are the non contact electromagnetic ultrasonic, interfacial reaction at ceramic/metal interface, growth mechanism of the reaction layer and so on. Mingxuan Zhangreceived bachelor’s degree from Harbin University of Science and Technology in July 2017. Since september 2017, he has been studying in the department of material science and engineering of Northeast Petroleum University, mainly focus on the research of ultrasonic-assisted brazing. |
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1 Xiong H, Li H, Mao W, et al. Materials Letters, 2003, 57(22-23),3417. 2 Feng G J, Li Z R, Xu K, et al. Transactions of the China Welding Institution, 2014, 43(1), 1(in Chinese). 冯广杰, 李卓然, 徐慨, 等.焊接学报, 2014, 35(1), 13. 3 Li Z R, Xu X L, Liu W B, et al. Transactions of the China Welding Institution, 2012, 33(11), 9(in Chinese). 李卓然, 徐晓龙, 刘文波, 等.焊接学报, 2012, 33(11), 9. 4 Lv H, Chu J X, Kang Z J, et al. Materials Review, 2004, 18(1), 36(in Chinese). 吕宏, 楚建新, 康志君, 等. 材料导报, 2004, 18(1), 36. 5 Zeng Z, Shao W H, Hu B R, et al. Proceedings of the CSEE, 2017, 37(1), 221(in Chinese). 曾正, 邵伟华, 胡博容, 等. 中国电机工程学报, 2017, 37(1), 221. 6 Wang S G, Zhang Y. Chinese Journal of Nature, 2011, 33(1), 42(in Chinese). 王守国, 张岩. 自然杂志, 2011, 33(1), 42. 7 Han J C, Zhang Y M, He X D, et al. Journal of Astronautics, 2001, 22(6), 124(in Chinese). 韩杰才, 张宇民, 赫晓东, 等. 宇航学报, 2001, 22(6), 124. 8 Yu K Q, Cheng P, Ding G F, et al. Transducer and Microsystem Technologies, 2018, 37(12), 1(in Chinese). 余开庆, 程萍, 丁桂甫, 等.传感器与微系统, 2018, 37(12), 1. 9 Zakaulla M, Khan A R A. International Journal of Science and Enginee-ring Research, 2014, 5(3), 1070. 10 Piekoszewski J, Krajewski A, Prokert F, et al. Vacuum, 2003, 70(2), 307. 11 Sheng Z, Wladyslaw W, Binshi X, et al. China Surface Engineering, 1998, 11(4), 5(in Chinese). Sheng Z, Wladyslaw W, Binshi X, 等. 中国表面工程, 1998, 11(4), 5. 12 Boadi J K, Yano T, Iseki T, et al. Journal of Material Science, 1987, 22(7), 2431. 13 Yano T, Suematsu H, Iseki T, et al. Journal of Materials Science, 1988, 23(9), 3362. 14 Chen B, Wu S B, Xiong H P, et al. Transactions of the China Welding Institution, 2016, 37(4), 47(in Chinese). 陈波, 吴世彪, 熊华平, 等.焊接学报, 2016, 37(4), 47. 15 Yan J C, Yang C L, Liu H J, et al. Journal of Mechanical Engineering, 2015, 51(24), 41(in Chinese). 闫久春, 杨春利, 刘会杰, 等. 机械工程学报, 2015, 51(24), 41. 16 Chen X, Yan J, Ren S, et al. Materials Letters, 2013, 105(a1), 120. 17 Yan J C, Sun X L. Welding & Joining, 2009(3), 6(in Chinese). 闫久春, 孙小磊. 焊接, 2009(3), 6. 18 Zhang Y, Yan J C, Wu Q, et al. Materials Science and Technology, 2009, 25(3), 379. 19 Khalid M H, Naka M. Trans JWRI, 2002, 31(2), 177. 20 Khalid M H, Naka M. Trans JWRI, 2003, 32(2), 309. 21 Naka M, Hafez K M. Journal of Materials Science, 2003, 38(16), 3491. 22 Han J C, Zhang Y M, He X D, et al. Astronaut, 2001, 22(6), 124. 23 Iwamoto C, Tanaka S. Acta Materialia, 1998, 46(7), 2381. |
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