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| Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics |
| ZHANG Shuye
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| State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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Abstract (a) APL ACFs fabrication process; (b) APL nanofibers cooperated with solders; (c) flex-on-flex interconnection using solder ACFs under bending test; (d) solder ACFs for flexible ultrasonic transducers; (e) ACFs used artificial skin electronics Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates[1]. Before that, flex-on-board (FOB) assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics, such as smart watches[2]. FOB is an alternative interconnection for the conventio-nal socket-type interconnection[3], by achieving a thinner package size, a higher electrical property, a fine-pitch capability and a higher long-term reliability[4]. Recently, for a higher reliability[5], solder particles have been applied in anisotropic conductive films (ACFs) to form micron-sized Sn joints. Compared with the polymer ball joints, 3 main advantages were introduced, such as lower resistance, higher reliability and higher power handling capability[6-8]. Therefore, the ACFs resin properties, silica filler contents, ultrasonic bonding & thermal compression bonding parameters have been developed and optimized for an entirely complete solder ACFs joint and a highly reliable FOB assembly.
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Published: 14 July 2020
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13 Miyamoto Akihito, et al. Nature Nanotechnology, 2017, 12(9),907. |
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2020, Vol. 34 
