不同温度下Sn-0.7Cu钎料在非晶Fe84.3Si10.3B5.4合金上的润湿行为及界面特征

doi:10.11896/j.issn.1005-023X.2018.18.019

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Abstract The sessile drop method and scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) was used to study the static wetting and interfacial microstructure morphology of Sn, Sn-37Pb, Sn-58Bi and Sn-0.7Cu on amorphous Fe_84.3Si_10.3B_5.4substrate. The research results showed that Sn-0.7Cu alloy was selected as better solder for amorphous Fe_84.3Si_10.3B_5.4alloy. The wetting behavior of Sn-0.7Cu solder on amorphous Fe_84.3Si_10.3B_5.4alloy at different temperatures was investigated by sessile drop method. The microstructure morphology and composition of Sn-0.7Cu solder/amorphous alloy substrate interface was analyzed by SEM and EDS. With increasement of soldering temperature, the final equilibrium wetting angle of Sn-0.7Cu solder on amorphous Fe_84.3Si_10.3B_5.4 alloy substrate was getting smaller and smaller, and the wettability was better. At the same time, the thickness of intermetallic compound (FeSn₂) forming at the interface between Sn-0.7Cu solder and amorphous Fe_84.3Si_10.3B_5.4 alloy substrate gradually increased which was from discontinuous to continuous distribution, and the interfacial reaction increased gradually.

Key words： Sn-Cu solder amorphous Fe_84.3Si_10.3B_5.4 alloy wetting behavior interfacial reaction

Published: 18 October 2018

CLC number:

TG425+.1

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	Articles by authors
	HOU Bin
	LIU Fengmei
	WANG Hongqin
	LI Qi
	WAN Di
	ZHANG Yupeng

Cite this article:

HOU Bin,LIU Fengmei,WANG Hongqin, et al. Wetting Behavior and Interfacial Characteristics of Sn-0.7Cu Solder on Amorphous Fe_84.3Si_10.3B_5.4 Alloy at Different Temperatures[J]. Materials Reports, 2018, 32(18): 3208-3212.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.18.019 OR http://www.mater-rep.com/EN/Y2018/V32/I18/3208

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