电子封装用Au-20Sn钎料研究进展

doi:10.11896/cldb.18080163

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Abstract Au-20Sn solder occupies an important position in the microelectronic devices and optoelectronic devices packaging industries due to its excellent comprehensive properties and fluxless packing. In recent years, the research of Au-Sn solder have been focusing on the preparation technology and the reliability of solder joints, which are the hot topic in the field of electronic packaging.
However, there are some problems in the development and application of Au-20Sn solder. Firstly, it is difficult to process by conventional me-thod because of the brittle intermetallic compounds in the coarse as-cast microstructure of Au-Sn solder. Secondly, the higher gold content always results in high costs of the solder. Thirdly, the inclusion is unavoidable during the manufacturing process. At last, the reliability of solder joints has not been reported systematically.
The coarse as-cast microstructure and inhomogeneous distribution of intermetallic compounds (IMCs) can lead to the brittleness of the solder, which is difficult to prepare Au-Sn solder by traditional casting and rolling process. Therefore, researchers continue to optimize the preparation methods of Au-Sn solder, and use casting toughening and other processes to effectively control the formation and distribution of brittle IMCs in the preparation process, greatly improving the performance of Au-Sn solder. In high reliability electronic packaging and chip packaging industries, the coatings usually can be used to improve the weldability of electronic components. Cu, Ni and Au are commonly used as substrate materials and surface metallization layers in electronic packaging. The IMCs formed between Au-Sn solder and coated metal are the basis for reliable bonding. At present, the research on the interaction between Au-Sn solder and different coated metals are mainly focused on the evolution of IMCs at the interface during soldering and the influence mechanism of solder joint reliability during aging. In addition to optimizing the preparation process and exploring different interfacial reactions of Au-Sn solder, many researchers have attempted to study the reliability of solder joints such as soldering rates and sealing properties. By continuously optimizing the soldering parameters and formulating reasonable process specifications, the soldering rates and sealing properties are used as important indexes to evaluate the performance and stable operation of high power electronic and optoelectronic devices.
This paper focuses on analysing the advantages and the difficulties in preparation technology of Au-20Sn solder, and describes the research progress of the reliability of Au-20Sn solder joints in fluxless packaging such as soldering rates and sealing properties. In addition, the interface reactions of Au-20Sn solder and various coating metals are discussed in details. At the same time, some suggestions are put forward which maybe solve the issues mentioned above, which may provide theory guide for the Au-20Sn solder.

Key words： Au-20Sn solder intermetallic compounds interface reaction reliability of solder joints

Published: 02 July 2019

CLC number:

TG425+.1

Fund:This work was supported by the National Natural Science Foundation of China (51675269) and the Priority Academic Program Development (PAPD) of Jiangsu Higher Education Institutions, China.

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	Articles by authors
	WANG Liujue
	XUE Songbai
	LIU Han
	LIN Yaowei
	CHEN Hongneng

Cite this article:

WANG Liujue,XUE Songbai,LIU Han, et al. Research Progress of Au-20Sn Solder for Electronic Packaging[J]. Materials Reports, 2019, 33(15): 2483-2489.

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http://www.mater-rep.com/EN/10.11896/cldb.18080163 OR http://www.mater-rep.com/EN/Y2019/V33/I15/2483

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