新一代高导热金属基复合材料界面热导研究进展*

doi:10.11896/j.issn.1005-023X.2017.07.011

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Abstract Thermal boundary resistance(TBC) exists at interface sandwiched between two materials with different physical properties. The TBC greatly affects the heat transfer and largely determines the thermal properties of the composites. Diamond particles reinforced metal matrix composites (MMCs) give full play to the advantages of high thermal conductivity and low thermal expansion coefficient of diamond, and it has the potential to achieve a high thermal conductivity and a thermal expansion coefficient compa-tible with semiconductor. This can meet the ever-increasing demands of cooling capacity of modern electronic devices. Consequently, MMCs have attracted widespread concern as a new generation of electronic packaging materials. TBC(the reciprocal of thermal boundary resistance) is a key factor in determining the heat conduction ability of composite. In addition, the TBC is difficult to deal with since the preparation process of composite, interface modification methods (metal matrix alloying or diamond surface metallization) and modifying metal species can all have an effect. In this paper, the latest achievements in both theoretical and experimental researches of TBC are discussed. Meanwhile, the main questions faced in the investigation of diamond/metal composites are also proposed.

Key words： electronic packaging materials thermal boundary conductance diamond metal matrix composites thermal conductivity

Published: 08 May 2018

CLC number:

O551.3

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	CHANG Guo
	DUAN Jialiang
	WANG Luhua
	WANG Xitao
	ZHANG Hailong

Cite this article:

CHANG Guo,DUAN Jialiang,WANG Luhua, et al. Thermal Boundary Conductance of a New Generation of High Thermal Conductivity Metal Matrix Composites: A Review[J]. Materials Reports, 2017, 31(7): 72-78.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2017.07.011 OR http://www.mater-rep.com/EN/Y2017/V31/I7/72

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