胶粘剂在湿热环境下的老化行为规律及环境损伤机理

doi:10.11896/cldb.22090006

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Abstract Moisture-temperature alternative test was applied to silicon rubber adhesive and epoxy adhesive, which are two typical types of adhesives. Their aging behavior and damage mechanism in the hydrothermal environment were studied from material and bonding interface perspectives, etc. The results show that the post-curing reaction exists in the initial stage of experiment, which leads to the increase of tensile shear strength and thermal decomposition temperature. Moreover, the tensile shear strength and thermal decomposition temperature decrease along with the aging process. The interface failure mode of silicon rubber adhesive transforms from mixed failure (dominated by cohesive failure) to interface failure. And the interface failure mode of epoxy adhesive transforms from mixed failure (dominated by interface failure) to interface failure. In addition, the side group oxidation, the cyclization depolymerization of Si-O structure, hydrolysis reaction, and cross-linking reaction may occur during the aging of the silicone rubber adhesive. And the degradation of C-N bond and oxidation reaction of the hydroxyl group/N-linked methy-lene group could exist in the aging of the epoxy adhesive.

Key words： adhesive adhesive interface moisture-temperature alternative test aging behavior damage mechanism

Published: 10 March 2024 Online: 2024-03-18

CLC number:

TB324

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	Articles by authors
	SUN Maojun
	HU Tao
	LUAN Hongbo
	LI Qian
	SHE Zuxin
	BAI Yuhe
	WANG Ling
	YANG Xiaokui
	ZHOU Kun

Cite this article:

SUN Maojun,HU Tao,LUAN Hongbo, et al. Aging Behavior and Damage Mechanism of Adhesives in the Hydrothermal Environment[J]. Materials Reports, 2024, 38(5): 22090006-6.

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http://www.mater-rep.com/EN/10.11896/cldb.22090006 OR http://www.mater-rep.com/EN/Y2024/V38/I5/22090006

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