| AEROSPACE MATERIALS |
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| Research on Preparation and Property of Polyimide Aerogel and Its Thin Composite |
| LEI Yaofei*, SHEN Yuxin, AI Sufen, DONG Wei, CHEN Hao, ZHANG Pengfei, LIU Jia
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| Beijing Spacecrafts, Beijing 100094, China |
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Abstract Thermal insulation materials with low thermal conductivity and flexibility are urgently needed in spacecraft and advanced weapons. Because of bad mechanical property, high brittleness and inflexibility, typical silica-based, alumina-based and carbon-based inorganic aerogel thermal insulation materials cannot meet thermal insulation requirements in narrow space and curved surface. Compared with inorganic aerogel, polyimide (PI) aerogel has excellent mechanical properties, flexibility and low thermal conductivity, which makes it have broad application prospect in the field of flexible thermal insulation. In this work, PI aerogel and their composites were prepared by sol-gel method and supercritical drying techno-logy. The research shows that the density of PI aerogel is as low as 0.032 g/cm3, that thermal stability is good, and that thermal conductivity is 0.025 8 W/(m·K). The thermal conductivity of thin PI aerogel composites is 0.023 0 W/(m·K), which is comparable to the thermal insulation performance of inorganic aerogel composites. Moreover, the thin PI aerogel composites exhibit good flexibility. This study gives the first report on thin flexible PI aerogel composites.
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Published: 25 November 2022
Online: 2022-11-25
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2022, Vol. 36 
