聚酰亚胺薄膜表面导电金属层化学沉积技术研究

doi:10.11896/cldb.22030280

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Abstract In order to make the polyimide (PI) film material have good surface conductivity and meet its application in aerospace fields, like radar antenna, the highly chemically inert PI material on the surface was modified by alkaline etching, and the metal layers on the surface of PI film were then deposited by electroless copper plating technology. The microstructure of the PI film before and after surface modification, as well as properties of surface metal layer on PI film was characterized by SEM, XRD, AFM, FTIR and so on. After alkaline etching at room temperature, there is a staggered and evenly distributed protrusion morphology with dendritic and rivet structures on the surface of PI. However, the PI film surface etched at 60 ℃ presents pits with different sizes and depths of etching holes, and the hydrophilicity of the PI film surface is enhanced after etc-hing. The metal layers on the surface of PI film behave uniform and dense, with good conductivity and good adhesion with PI film substrate. The staggered protrusion structure on the surface of PI film after modification provides a good deposition and intercalation junction point for the nucleation and crystallization of the metal layer on the surface of PI film, forming a superior interface interlock between the metal layers and the PI substrate, so as to benefit the metal layer with high bonding force on the surface of PI film. This work realizes the preparation of metal layer with high conductivity and superior bonding force on the PI surface under alkaline etching, and can provide technical support for the application of polyimide in aerospace fields.

Key words： alkaline solution etching modification polyimide interface bonding mechanism binding force surface metallization

Published: 25 November 2022 Online: 2022-11-25

CLC number:

TB332

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	Articles by authors
	WANG Nan
	BAI Jingying
	LI Jiafeng
	FENG Li
	XU Junjie
	HE Yanlong
	DONG Junwei
	CUI Qingxin
	ZHANG Ligong

Cite this article:

WANG Nan,BAI Jingying,LI Jiafeng, et al. Study on Chemical Deposition Technology of Conductive Metal Layer on Polyimide Film Surface[J]. Materials Reports, 2022, 36(22): 22030280-6.

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http://www.mater-rep.com/EN/10.11896/cldb.22030280 OR http://www.mater-rep.com/EN/Y2022/V36/I22/22030280

1 Zhang J Y, Ni H J, Gong M, et al.Acta Materiae Compositae Sinica, 2021, 38(10), 3247(in Chinese).
张嘉阳, 倪洪江, 龚明, 等.复合材料学报, 2021, 38(10), 3247.
2 Li J F, Wang N, Bai J Y, et al.Surface Technology, 2022, 51(3), 9(in Chinese).
李家峰, 王楠, 白晶莹, 等. 表面技术, 2022, 51(3), 9.
3 Liu J H, Zhan Z, Zhen F, et al.Sensors and Actuators B: Chemical, 2020, 308,127694.
4 Sun B, Zhang Z L, Xu J, et al.Journal of Materials Science & Technology, 2022, 102, 264.
5 Xu C, Qiu X Y, Guo Y, et al. Surface Technology, 2021, 50(6), 169(in Chinese).
徐灿, 邱心宇, 郭云, 等. 表面技术, 2021, 50(6), 169.
6 Zhang L H, Tang G C, Cui K F.Electroplating & Finishing Electroplat Finish, 2020, 39(21), 1477(in Chinese).
张立红, 唐光超, 崔开放. 电镀与涂饰, 2020, 39(21), 1477.
7 Lu J, Zou G X, Zhuang Y B. Insulating Materials, 2021, 54(11), 34(in Chinese).
陆健, 邹国享, 庄永兵. 绝缘材料, 2021, 54(11), 34.
8 Huang P, Que Z B, Jiang Y, et al. Materials Reports A: Review Papers, 2009, 23(7), 107(in Chinese).
黄培, 阙正波, 蒋英, 等. 材料导报:综述篇, 2009, 23(7), 107.
9 Chen Q, Zhang X H, Zhou C, et al. Electroplating & Finishing Electroplat Finish, 2018, 37(23), 1080(in Chinese).
陈琴, 张兴华, 周超, 等.电镀与涂饰, 2018, 37(23), 1080.
10 Mu H F, Liu K, Li Z H, et al. Electroplating & Finishing Electroplat Finish, 2016, 35(24), 1286(in Chinese).
慕慧峰, 刘凯, 李中华, 等.电镀与涂饰, 2016, 35(24), 1286.
11 Cui G, Qi S, Wang X, et a1. Journal of Physical Chemical B, 2012, 116(40), 12349.
12 Wang Y, Li N, Wang X, et a1. RSC Advances, 2016, 6(9), 7582.
13 Zhan L Z, Wu L J, Tian G Z, et a1. Journal of Functional Polymers, 2020, 33(5), 467(in Chinese).
詹淋中, 吴力佳, 田桂芝, 等. 功能高分子学报,2020,33(5),467.
14 Lee W J, Kim Y B. Thin Solid Films, 2008, 517(3), 1191.
15 Bag A, Choi S H. Materials Characterization, 2017, 129, 186.
16 Chen J J, An Q, Rodriguez R D, et a1. Applied Surface Science, 2019, 487, 503.
17 Lin J H, Chen Y M, Wang S X, et al. Electroplating & Finishing Electroplat Finish, 2018, 40(1), 1(in Chinese).
林建辉, 陈苑明, 王守绪, 等.电镀与精饰, 2018, 40(1), 1.
18 Wang D X. Preparation of polyimide/silver composite film based on in-situ chemical plating. Master's Thesis, Harbin University of Science and Technology, China, 2017(in Chinese).
王德鑫. 基于原位化学镀制备PI/Ag复合薄膜. 硕士学位论文, 哈尔滨理工大学, 2017.
19 Jin Y, Zeng G F, Zhu D Y, et al. Chinese Journal of Applied Chemistry, 2011, 28(3), 257(in Chinese).
金盈, 曾广赋, 朱丹阳,等. 应用化学, 2011, 28(3), 257.