利用蔗糖改性氮化硼提高环氧树脂复合材料的导热性能

doi:10.11896/cldb.21110039

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Abstract Epoxy resin has a series of advantages such as light weight, excellent anti-corrosion performance and excellent insulation performance, so it is widely used in many fields such as electrical equipment, high-voltage insulation system and aerospace. However, the intrinsic thermal conductivity of epoxy resin is low, about 0.11—0.19 W/(m·K). Such a low thermal conductivity is not conducive to the timely and effective heat dissipation of the system. Boron nitride nanosheets (BNNS) have broad application prospects in high-voltage insulation systems due to their excellent thermal conductivity and insulation properties. However, the complex preparation process and poor dispersibility of BNNS in liquids are currently the main factors that limit their wide application. A simple and effective sucrose-assisted mechanochemical peeling (SAMCE) method was used to realize the peeling and modification of BNNS at the same time. The h-BN obtained by the sucrose peeling modification was added to the epoxy resin. When the mass fraction of modified h-BN was 15%, the thermal conductivity of the composite material could reach 0.51 W/(m·K). At this time, the thermal conductivity of the composite material was 3.2 times that of the pure epoxy resin material, and the thermal conductivity was significantly improved. In order to explain the mechanism of modified h-BN to improve the thermal conductivity of epoxy resin composites, the interface thermal resistance between filler particles and matrix in the h-BN/epoxy composite before and after the modification was calculated based on the effective medium approximation (EMA) theoretical model. The calculated interface thermal resistance of the h-BN/epoxy resin composite material was 2.44×10^-6 m²·K/W, and the interface thermal resistance of the modified h-BN/epoxy resin composite material was 4.73×10^-7 m² ·K/W, the interface thermal resistance of the modified h-BN/epoxy resin composite was about 1/5 of that before modification.

Key words： boron nitride epoxy resin interface thermal resistance sucrose modification thermophysical property

Published: Online: 2023-02-08

CLC number:

TB332

Fund:National Natural Science Foundation of China (52076080).

Corresponding Authors: xuemingyang@ncepu.edu.cn.

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	YANG Xueming
	HU Zongjie
	WANG Weichen
	LIU Qiang
	WANG Shuai

Cite this article:

YANG Xueming,HU Zongjie,WANG Weichen, et al. Enhanced Thermal Conductivity of Epoxy Composites with Sucrose Modified Boron Nitride[J]. Materials Reports, 2023, 37(2): 21110039-6.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.21110039 OR http://www.mater-rep.com/EN/Y2023/V37/I2/21110039

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