合金元素对Cu/Sn-/Cu回流焊焊点界面微观结构及剪切性能的影响

doi:10.11896/cldb.20050139

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Abstract Three different solders, Sn64Bi 35Ag1, Sn64.7Bi 35Ag0.3 and Sn99Ag 0.3Cu0.7, were selected for the reflow welding test. The effects of high Bi, low Ag and low Ag solders on microstructure and tensile shear properties of Sn-based solder joints were investigated. The results show that a scallop-like Cu₆Sn₅ intermetallic compound is formed at the interface of each solder joint. In the solder joint containing Bi, the accumulation of Bi at the interface and inside of the solder joint leads to the increase of the thickness of the intermetallic compound layer at the interface, and a large number of Bi-rich phases are brittle. The decrease of Ag content in the solder weakens the enrichment of Bi in the solder joint. The thickness of intermetallic compound layer at the interface of Sn99Ag0.3Cu0.7 solder joint is the smallest, and fine Ag₃Sn phase particles are formed in the solder joint. The eutectic structure is uniformly distributed, which makes the shear performance of the solder joint optimal, and the shear strength reaches 20.4 MPa.

Key words： alloy elements Sn-based solders reflow soldering microstructure shearing properties

Published: 03 August 2021

CLC number:

TG453.9

Fund:Foundation of Key Laboratory of Nondestructive Testing, Ministry of Education (EW201703508).

About author:: Ping Yang, studying in Nanchang Hangkong University. Mainly engaged in friction stir welding and electro-nic packaging research.
Yuqing Mao received his Ph.D. degree in state key laboratory of solidification processing from Northwestern Polytechnical University (NWPU) in Sep. 2012—Mar. 2017. He was appointed to the faculty upon graduation in Nanchang Hangkong University (NCHU), and is currently a lecturer of the NCHU. He has published more than 40 journal papers as the first author, applied 3 national invention patents and 2 of them were autho-rized. In addition, he is a reviewer of several academic journals. His research interests focus on the advanced joining technology of the advanced metals, metal matrix composite processing and additive manufacturing technology of advanced metal, and the fundamental theory & application about the advanced processing and microstructure & property control.

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	YANG Ping
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Cite this article:

YANG Ping,MAO Yuqing,LI Qianpeng, et al. Effects of Alloy Elements on Microstructure and Shearing Properties of Cu/Sn-/Cu Reflow Soldering Joints[J]. Materials Reports, 2021, 35(14): 14156-14160.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.20050139 OR http://www.mater-rep.com/EN/Y2021/V35/I14/14156

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