应用于功率芯片封装的瞬态液相扩散连接材料与接头可靠性研究进展

doi:10.11896/cldb.20040187

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Abstract Power semiconductors have gradually developed towards miniaturization and high densification due to their high working voltage, large current and large heat dissipation. The new generation of wide bandgap semiconductor devices can increase the operating temperature and power density, showing a good application prospect, which puts forward higher requirements for matching power packaging materials.
With the continuous increase of operating temperature, the safety issues such as instability and unstable operating environment under high temperature need to be solved, which puts forward higher requirements for the high temperature reliability of power chip packaging. The research of lead-free solder and the corresponding joining technology is the focus of current research because high-lead solder is not environmentally friendly.
Transient liquid phase bonding (TLP bonding) technology can meet the requirements of “low-temperature bonding and high-temperature ser-vice” by forming high-melting-resistant intermetallic compounds joints at low temperatures, and has good application prospects in high-temperature packaging of the new generation of power semiconductors. The high temperature resistant packaging materials for TLP bonding include Sn-based, In-based and Bi-based, etc. At present, TLP bonding materials mainly have the form of lamination, solder paste and preform. Among them, laminated solder was first applied to TLP bonding, and there have been relatively mature researches on bonding mechanism and joint performance and reliability. In recent years, solder paste and preform based on the composite powder have relatively high reaction efficiency. However, sufficient theoretical and experimental studies are needed to verify its industrial application prospects.
The characteristics of Sn-based and In-based solder for TLP bonding are reviewed. The status and progress of TLP bonding mechanism, the microstructure of joints, mechanical properties and structural reliability of different solders are presented. The study for inhibition of defects in the joint, the phase transformation mechanism and failure mechanism of the joint under different service conditions will be significant in the preparation of high-reliability joints.

Key words： transient liquid phase bonding power chip high-temperature packaging solder structural reliability

Published: 03 November 2021

CLC number:

TG425

Fund:National Natural Science Foundation of China (51777203) , Beijing International Science and Technology Cooperation Base of Carbon-based Nanomaterials, and International Research Cooperation Seed Fund of Beijing University of Technology (A14).

About author:: Xuan Liu received her B.E. degree in materials science and engineering from Beijing University of Technology in 2018. She is currently pursuing her master degree in College of Materials Science and Enginee-ring, Beijing University of Technology under the supervision of Prof. Hong Li and Hongyan Xu from Institute of Electrical Engineering, Chinese Academy of Scie-nces, Beijing. Her research has focused on tran-sient liquid phase bonding for power chip packaging.
Hongyan Xu is a senior engineer at the Institute of Electrical Engineering, Chinese Academy of Sciences. She received her Ph.D. degree in the Institute of Process Engineering, Chinese Academy of Sciences, Beijing, in 2011. From 2011 to 2015, she worked in the Institute of Metallic Materials, Beijing General Research Institute of Mining and Metallurgy. From 2015 to now, she has worked in the Institute of Electrical, Chinese Academy of Sciences. Her main research fields include high-temperature packaging materials for power electronics packaging and transient liquid phase bonding technology. She has published more than 20 research papers and applied for 5 invention patents.
Hong Li is currently an associate professor of Beijing University of Technology. She received her Ph.D. degree in materials processing engineering from University of Science and Technology, Beijing, in 2006. From 2006 to 2008, she worked as a postdoctor in Beijing University of Technology. From 2012 to 2013, she carried out visiting scholar research funded by CSC in Dortmund University of Technology. In 2013, she was appointed as vice-chairwoman of Sub-Commission C-XVII-C (Soldering) of International Institute of Institute of Welding (IIW). Her main research fields include brazing, joining of dissimilar materials and micro-nano scale joining. She has published more than 70 research papers and obtained 14 granted China national invention patents.

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Cite this article:

LIU Xuan,XU Hongyan,LI Hong, et al. Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging[J]. Materials Reports, 2021, 35(19): 19116-19124.

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http://www.mater-rep.com/EN/10.11896/cldb.20040187 OR http://www.mater-rep.com/EN/Y2021/V35/I19/19116

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