METALS AND METAL MATRIX COMPOSITES |
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Research Progress on Preparation, Properties and Application of Precious Metal Ruthenium |
ZHANG Renyao, GUO Junmei, WEN Ming, GUAN Weiming
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State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Kunming Institute of Precious Metals, Kunming 650106, China |
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Abstract Ruthenium (Ru),precious metal, is widely used in modern industry. In present paper, the preparation methods of Ru bulk materials are introduced firstly. Moreover, the plasticity, machinability, and influence factors are analyzed. The X-ray diffraction used to measure the internal stress is presented. Secondly, the preparation methods of Ru thin films are reviewed. We also present the application of Ru films such as the bonding layer/diffusion barrier layer for copper in integrated circuits, the intermediate layer/seed layer in magnetic recording media, anti-oxidation protective layer materials and electrical contact materials, etc. In the end, the present research shortcomings of Ru are summarized and a vision of its future research trends is made.
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Published: 30 November 2021
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Fund:National Key Research and Development Program (2017YFB0305503), Yunnan International Cooperation Project(2014IA037),Yunnan Province Institute Special Project (2009CF003),and Yunnan Innovation Team Project (2019HC024). |
About author:: Renyao Zhang, graduated from Yunnan Agricultural University in June 2015 with a bachelor's degree in engineering. He is currently a master student of Kunming Institute of Precious Metals, and conducts research under the guidance of Mr. Wen Ming. At present, the main research fields are precious metal sputtering targets. Ming Wen received his Ph.D degree in Materials Science from the School of Materials Science and Engineering of Shanghai Jiaotong University. He has been worked for Kunming Institute of Precious Metals since he graduated from Shanghai Jiaotong University. His research interest is sputtering targets and related thin films. He has published more than 50 SCI papers recently, including Scripta Materialia,Surface & Coatings Technology, Applied Surface Science, etc. |
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1 Deng R, Wen M, Chen J L, et al. Precious Metals, 2019, 40(1), 82(in Chinese). 邓瑞,闻明,陈家林,等. 贵金属, 2019, 40(1), 82. 2 Seddon E A, Seddon K R, Clark R. The chemistry of rutherium, Elsevier Science Publishing, USA, 1984. 3 Wang H, He X T, Zhao Y, et al. Precious Metals, 2018, 39(S1), 167(in Chinese). 王欢,贺小塘,赵雨,等. 贵金属, 2018, 39(S1), 167. 4 Tylus P, Zick D, Hall J. U.S. patent, US20070116592, 2007. 5 Luo J F, Ding Z C, Dong T Y, et al. Powder Metallurgy Industry, 2012, 22(1), 28(in Chinese). 罗俊锋,丁照崇,董亭义,等. 粉末冶金工业, 2012, 22(1), 28. 6 谭志龙,管伟明,张昆华,等. 中国专利, CN102605332A, 2012. 7 Rhys D W. Journal of the Less Common Metals, 1959, 1(4), 269. 8 Yan Q S.Science and Technology Innovation Herald. 2016, 13(31), 36(in Chinese). 闫秋实. 科技创新导报, 2016, 13(31), 36. 9 Deng Z H, Zhang C, Wang H B, et al. Materials for Mechanical Engineering, 2019, 43(7), 20(in Chinese). 邓正华,张聪,王海宝,等. 机械工程材料, 2019, 43(7), 20. 10 Jiang F, Li Y M, Li S L. Powder Metallurgy Industry, 2003(6), 18(in Chinese). 姜峰,李益民,李松林. 粉末冶金工业, 2003(6), 18. 11 Mao K, Yan Q Z, Ge C C, et al. Powder Metallurgy Industry, 2011, 21(2), 25(in Chinese). 毛凯,燕青芝,葛昌纯,等. 粉末冶金工业, 2011, 21(2), 25. 12 Angerer P, Wosik J, Neubauer E, et al. International Journal of Refractory Metals and Hard Materials, 2009, 27(1), 105. 13 Zhang J, Zhang Y, Xu K, et al. Thin Solid Films, 2007, 515, 7020. 14 闻明, 张仁耀, 管伟明,等. 中国专利, CN111270210A, 20200612. 15 Wang P, Pan Y J, Hong B, et al. Journal of Wuhan University of Science and Technology, 2017, 40(1), 23(in Chinese). 王盼,潘应君,洪波,等. 武汉科技大学学报, 2017, 40(1), 23. 16 Kim S K, Lee S Y, Lee S W, et al. Journal of the Electrochemical Society, 2007, 154(2), 95. 17 Shin J, Waheed A, Winkenwerder W A, et al. Thin Solid Films, 2007, 515(13), 5298. 18 Chen J, Wang L, Wu P. Thin Solid Films, 2010, 518(24), 7245. 19 Xu W J. Modern Instruments, 2005(5), 1(in Chinese). 徐万劲. 现代仪器, 2005(5), 1. 20 Matsubara H, Yonekawa T, Ishino Y, et al. Electrochimica Acta, 2006, 52(2), 402. 21 Kay P J,C A Makay I TRI, Fan H Y. Electronic Process Technology. 1985(3), 2(in Chinese) Kay P J,C A Makay I TRI,方鸿渊.电子工艺技术, 1985(3), 2. 22 Peters L. Applications of IC, 2006(9), 32. 23 Chan R, Arunagiri T N, Zhang Y, et al. Electrochemical and Solid-State Letters, 2004, 7(8), G154. 24 Choi B H, Lim Y H, Lee J H, et al. Microelectronic Engineering, 2010, 87(5-8), 1391. 25 Chyan O, Arunagiri T N, Ponnuswamy T. Journal of the Electrochemical Society, 2003, 150(5), C347. 26 Wang Z Y, Zhou J W, Zhang J J, et al. Micronanoelectronic Technology, 2018, 55(12), 863(in Chinese). 王子艳,周建伟,张佳洁,等. 微纳电子技术, 2018, 55(12), 863. 27 Kwon O, Kim J, Park H, et al. Journal of the Electrochemical Society, 2004, 151(2), G109. 28 Wang Z, Sakaue H, Shingubara S, et al. Japanese Journal of Applied Physics, 2003, 42(Part 1, No. 4B), 1843. 29 Sun H, Kim K, Kim Y, et al. Japanese Journal of Applied Physics, 2003, 42(Part 1, No. 2A), 582. 30 Tompkins H G, Sellers J A. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1994, 12(4), 2446. 31 Kwon O, Kwon S, Park H, et al. Journal of the Electrochemical Society, 2004, 151(12), C753. 32 Kwon O, Kwon S, Park H, et al. Electrochemical and Solid-State Letters, 2004, 7(4), C46. 33 Xie Q, Jiang Y, Musschoot J, et al. Thin Solid Films, 2009, 517, 4689. 34 Zhao X, Magtoto N P, Kelber J A. Thin Solid Films, 2005, 478, 188. 35 Wu Y Y, Kohn A, Eizenberg M. Journal of Applied Physics, 2004, 95(11), 6167. 36 Chen J, Huang S, Wu P, et al. Thin Solid Films, 2013, 529, 426. 37 Nagano T, Inokuchi K, Tamahashi K, et al. Thin Solid Films, 2011, 520(1), 374. 38 Sir Cottrell A. An introduction to metallurgy, Edward Arnold(Publishers) Ltd, USA,1975. 39 Wei W, Parker S L, Sun Y M, et al. Applied Physics Letters, 2007, 90(11), 111906. 40 Arunagiri T N, Zhang Y, Chyan O, et al. Applied Physics Letters, 2005, 86(8), 83104. 41 Park S H, Kim S O, Lee T D, et al. Journal of Applied Physics, 2006, 99(8), 1976. 42 Zhang J M, Guan W M, Li Y Q, et al. Precious Metals, 2012, 33(4), 38(in Chinese). 张俊敏,管伟明,李艳琼,等. 贵金属, 2012, 33(4), 38. 43 Lee H S, Zhu J G, Laughlin D E. Journal of Applied Physics, 2008, 103(7), 2318. 44 Hirayama Y, Tamai I, Takekuma I, et al. Journal of Physics: Conference Series, 2009, 165, 12033. 45 Velu E M T, Malhotra S, Bertero G, et al. IEEE Transactions on Magne-tics, 2003, 39(2), 668. 46 Zhang J M, Wang C J, Shen Y, et al. Precious Metals, 2015(2), 23(in Chinese). 张俊敏,王传军,沈月,等. 贵金属, 2015(2), 23. 47 Liu B Z. Metal World, 2009(6), 98(in Chinese). 刘宝忠. 金属世界, 2009(6), 98. 48 Yu F B, Chen Y. Insulation Materials, 2008, 41(6), 41(in Chinese). 余凤斌,陈莹. 绝缘材料, 2008, 41(6), 41. 49 Zhu W Z. China Science and Technology Information, 2019(16), 68(in Chinese). 朱文哲. 中国科技信息, 2019(16), 68. 50 Toler B F, Coutu R A, Mcbride J W. Journal of Micromechanics and Microengineering, 2013, 23(10), 103001. 51 Jhanwar P, Kumar A, Verma S, et al. AIP Conference Proceedings, DOI: 10.1063/1.4945193. |
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