纳米颗粒对无铅钎料改性的研究进展

doi:10.11896/cldb.19090088

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Abstract As electronic devices tend to be miniaturized and multi-functional, the solder joints and spacing interconnection requirements in microelectronic packaging are smaller, which puts forward higher requirements for the reliability of solder joints, and solder plays a vital role in the reliability of solder joints in electronic packaging. In recent years, individuals pay more attention to the concept of green development and concern about the toxicity of lead, and quite a few countries have legislated to ban the use of lead-containing solder, which has promoted the rapid development of lead-free solder. Neverthelss, there are many problems in lead-free solder, such as high cost, poor wettability and reliability. Therefore, exploring and developing lead-free solders with excellent properties still has a long way to go.
Nowadays, many researchers have chosen to add nano-sized particles in lead-free solder to enhance the comprehensive properties of compo-site solder, such as metal particles, metal compound particles, carbon-based nano-materials and so on. The results show that the addition of nanoparticles can refine the matrix structure, inhibit the growth of intermetallic compound (IMC) and improve the mechanical properties of solder alloys. Thus, the research and development of nanoparticle reinforced lead-free solder to improve the whole performance of the solder alloy has become a hotspot.
In this paper, the effect and mechanism of different types, sizes and contents of nanoparticles on the structure and properties of lead-free sol-der is comprehensively analyzed. Then, the effects of nanoparticles on the microstructure, wetting ability, mechanical performance, creep property, electromigration properties and reliability of the solders are discussed. Additionally, the modificated effect of submicron particles on 3D encapsulation interconnect solder joints is summarized. Finally, the shortcomings and future prospects of reinforced lead-free solder are put forward in order to provide basic theoretical guidance for the future development of particle reinforced lead-free solder with great properties.

Key words： electronic packaging lead-free soldering nanoparticles particle reinforced

Published: 12 March 2021

CLC number:

TG425

Fund:National Natural Science Foundation of China (51475220), Six Talent Peaks of Jiangsu Province (XCL-022) and the Key project of State Key Laboratory of AdvancedWelding and Joining (AWJ-19Z04).

About author:: Mulan Li received her bachelor’s degree in enginee-ring from Jiangsu Normal University in 2019. She is currently pursuing her master’s degree at school of Mechatronic Engineering, Jiangsu Normal University under the supervision of Prof. Liang Zhang. Her research has focused on microelectronic packaging materials and technology.
Liang Zhang received a bachelor’s degree in material forming and control engineering at Nanchang Aeronautical University in July 2006 and received his doctor’s degree in material processing engineering at Nanjing University of Aeronautics and Astronautics in 2011. As a public visiting scholar, visited the University of California at Los Angeles Electronic Thin Film Laboratory for research from April 2013 to July 2014. He is currently a full professor in Jiangsu Normal University. His research involved the field of electronic packaging technology, 3D packaging chip stacking, lead-free solder and interconnect technology, solder joint reliability, brazing materials and technology.

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	LI Mulan
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	JIANG Nan
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Cite this article:

LI Mulan,ZHANG Liang,JIANG Nan, et al. Research Progress of Using Nano-particles to Improve Properties of Lead-free Solders[J]. Materials Reports, 2021, 35(5): 5130-5139.

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http://www.mater-rep.com/EN/10.11896/cldb.19090088 OR http://www.mater-rep.com/EN/Y2021/V35/I5/5130

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