光敏聚苯并噁唑的研究现状与发展趋势

doi:10.11896/cldb.19080186

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Abstract As one of the typical thermal stable photosensitive dielectric materials, photosensitive polybenzoxazole (PSPBO) exhibits excellent mechanical properties, heat resistance, insulation properties, low water absorption, low dielectric constant and outstanding lithographic properties. It has been widely used in some key areas such as microelectronics and aerospace. In particular, PSPBO is widely employed in interlayer dielectric materials, stress buffer layers and protective layers in integrated circuit semiconductor packaging, being a key material for advanced processes in fan-out packaging. On the other hand, with the rapid development of 5G high-frequency and high-speed communication, flexible display and OLED et al., higher requirements of low temperature curing, high adhesive strength, low dielectric constant, and thermal conductivity have been raised. More importantly, core technology of PSPBO is absent in China. This mini-review describes the development of PSPBO, including positive-working PSPBO, negative-working PSPBO and the development of their applications. At the same time, some novel development prospects are prospected. We hope that this mini-review could provide useful information to Chinese researchers for the basic research and industrial applications of PSPBO.

Key words： thermal stable and photosensitive polymer photosensitive polybenzoxazole low temperature curing dielectric semiconductor package

Published: 05 November 2020

CLC number:

TQ572

Fund:This work was financially supported by R & D Funds for Basic Research Program of Shenzhen (JCYJ20160331191741738), NSFC-Guangdong Jointed Funding (U1601202), NSFC-Shenzhen Robot Jointed Funding (U1613215), China Postdoctoral Science Foundation (2018M640840), National Key R & D Project from Minister of Science and Technology of China (2017ZX02519) and National Natural Science Foundation of China (61904191).

About author:: Tao Wang received his B.S. degree in applied chemistry from Hefei University of Technology in 2018. He is currently pursuing his master degree at Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences under the supervision of Prof. Guoping Zhang. His research has focused on photosensitive polybenzo-xazole and polyimide materials
Jinhui Li received his B.S. degree in chemistry from Henan University in 2012 and received his Ph.D. degree in materials from Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, in 2017. After postdoctoral research at City University of Hong Kong (China), he is currently a postdoctoral/assistant researcher at Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences. His research has focus on photosensitive polyimide materials of wafer level fan-out packaging for 5G communication.
Guoping Zhang received his B.S. and Ph.D. degrees in chemistry from Hunan University in 2005 and 2010, respectively. After several years visiting research at Georgia Institute of Technology and Chinese University of Hong Kong (China), he is currently a professor at the Shenzhen Institutes of Advanced Technology (SIAT), Chinese Academy of Sciences. He is also a deputy director of Advanced Materials Research Center of SIAT and National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials. He is a member of IEEE from 2015. His research interests are critical materials for wafer level packaging.

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	WANG Tao
	LI Jinhui
	ZHAO Yaxu
	ZHU Liang
	ZHANG Shaoxia
	ZHANG Guoping
	SUN Rong
	WONG Chingping

Cite this article:

WANG Tao,LI Jinhui,ZHAO Yaxu, et al. Research Status and Development Trend of Photosensitive Polybenzoxazole[J]. Materials Reports, 2020, 34(19): 19183-19189.

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http://www.mater-rep.com/EN/10.11896/cldb.19080186 OR http://www.mater-rep.com/EN/Y2020/V34/I19/19183

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