紫铜超声波焊接微观结构演变及再结晶研究

doi:10.11896/cldb.19040120

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Abstract Three-dimensional metal waveguide element which includes received signal holes, local vibration signal holes and coupling holes is the key device of the next generation radio telescope. Ultrasonic augmentation provides a new method for fabricating the waveguide element, and the effective welding of copper sheet is one of the most important processes in this method. Previous studies on ultrasonic welding of red copper mainly focused on the optimal welding process, and few researches on recrystallization of copper ultrasonic welding were carried out. In this paper, Electron Backscattered Diffraction (EBSD) technique was used to observe the microstructure and texture changes of ultrasonic spot welding of copper, and the recrystallization process of ultrasonic spot welding of copper was studied.The results show :The average size at the interface of copper is reduced from 20 μ m to 1—2 μ m under the action of ultrasonic welding, which indicates that the grain size at the interface is refined by ultrasonic welding. There are mainly copper texture {112}〈111〉 and cubic texture cube {001}〈100〉 in the original red copper. After ultra-sonic welding, there are mainly shear textures {111}〈143〉, {111}〈110〉 and {221}〈122〉, in which a large number of regenerated fine cuboidal textures {100}〈001〉 and shear textures {111}〈110〉 exist at the welding interface. In the region with the small strain, discontinuous dynamic recrystallization DDRX usually occurs. The recrystallization nucleation mode is the grain boundary nucleation mode, while in the larger strain region, the continuous dynamic recrystallization CDRX is dominant. The crystalline nucleation form is related to the subgrain.

Key words： copper ultrasonic welding electron backscattered diffraction(EBSD) recrystallization texture

Published: 26 April 2020

CLC number:

TG405

Fund:This work was financially supported by the National Natural Science Foundation of China (51365039), National Natural Science Foundation of China Astronomical Joint Fund of Chinese Academy of Sciences (U1731118).

Corresponding Authors: Zhengqiang Zhu, Nanchang University, Professor, mainly researched the ultrasonic additive manufactu-ring, high-strength steel resistance spot welding and other advanced manufacturing technology. He has published more than 60 articles in important journals, including more than 40 SCI and EI searches.

About author:: Qiankun Xiao, master of engineering, mainly researched the microstructure evolution and connection mechanism of metal ultrasonic welding.

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	XIAO Qiankun
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	LI Mingfeng

Cite this article:

XIAO Qiankun,ZHU Zhengqiang,LI Mingfeng. Research on Microstructure Evolution and Recrystallization of Ultrasonic Welding in Copper[J]. Materials Reports, 2020, 34(10): 10157-10161.

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http://www.mater-rep.com/EN/10.11896/cldb.19040120 OR http://www.mater-rep.com/EN/Y2020/V34/I10/10157

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