Abstract: The isothermal compression tests of Cu-3.0Ni-0.64Si alloy were proceed at 750—900 ℃ with the strain rate of 0.001—1 s-1. The results showed that the peak stress decreased with the increase of the deformation temperature or the decrease of the strain rate, and the alloy was prone to dynamic recrystallization. The hot deformation activation energy was 410.4 kJ/mol and the corresponding thermal deformation constitutive relation equation was ε=e40.56[sinh(0.017σ)]5.21exp [-410.4×103/(RT)] of Cu-3.0Ni-0.64Si alloy, which were obtained by the linear regression analysis. The effects of the deformation temperature and strain rate on the microstructure of Cu-3.0Ni-0.64Si alloy were discussed. The hot processing maps of different true strain were constructed based on the dynamic material model and Prasad instability criterion. The optimized process parameters were deformation temperature of 860—900 ℃ and strain rate of 0.002—0.01 s-1.
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