Ni/P质量比对Cu-Ni-P合金组织和性能的影响

doi:10.11896/cldb.24030240

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Abstract The Cu-Ni-P alloys were designed and prepared with varying Ni/P mass ratios based on phase diagrams. The effects of the Ni/P mass ratio on the microstructure and properties of the alloys were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), hardness and conductivity tests. In addition, the correlation between the evolution of precipitated phase and the hardness and conductivity has been established. The results show that the Ni/P mass ratio has a significant impact on the both hardness and conductivity of the alloy. After aging at 500 ℃ for 3 h, the hardness and conductivity of the alloy with a Ni/P mass ratio of 4 reached the maximum of 171HV and 61.8%IACS, respectively. The increase in P content facilitates the precipitation of Ni atoms from the copper matrix, thereby reducing the concentration of solute atoms and ultimately enhancing the electrical conductivity of the alloy. In the early stage of aging, abundant spheroidal NiP₃ phase formation serves as a primary factor contributing to increased alloy hardness. During the aging process, the precipitates in the alloy gradually transforms into spherical NiP₂ and short rod-like Ni₂P phases.

Key words： Cu-Ni-P alloy Ni/P mass ratio hardness electrical conductivity microstructure

Published: 25 May 2025 Online: 2025-05-13

CLC number:

TG146.1

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	Articles by authors
	ZHANG Jianbo
	SHEN Qifei
	YIN Ningkang
	ZHANG Jinhan
	LIU Jingxuan

Cite this article:

ZHANG Jianbo,SHEN Qifei,YIN Ningkang, et al. Effect of Ni/P Mass Ratio on Microstructure and Properties of Cu-Ni-P Alloy[J]. Materials Reports, 2025, 39(10): 24030240-6.

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https://www.mater-rep.com/EN/10.11896/cldb.24030240 OR https://www.mater-rep.com/EN/Y2025/V39/I10/24030240

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