利用聚多巴胺硅烷双重改性氮化硼提高环氧树脂复合材料热物性

doi:10.11896/cldb.22070092

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Abstract Filling epoxy resin with inorganic filler to form composite material can effectively improve the low thermal conductivity of epoxy resin, but high filler content tends to reduce the mechanical properties of composites. Thiswork examined the full set of physical characteristics of modified boron nitride/epoxy resin composites with a negligible amount of thermally conductive fillers (less than 15wt%). The thermal conductivity, thermal stability, and mechanical characteristics of modified filler composites with various contents were examined after boron nitride was modified using dopamine and silane coupling agents and added to epoxy resin. The results show that the surface modification enhances the resin's compatibility and dispersibility. The thermal conductivity, glass transition temperature, and thermal stability of the boron nitride/epoxy composites have all been significantly enhanced when compared to boron nitride/epoxy composites and modified boron nitride/epoxy composites. The glass transition temperature and thermal decomposition temperature (T_10%) are increased to 132.34 ℃ and 379.68 ℃, respectively, which are 10.44 ℃ and 10.2 ℃ higher than pure epoxy when the content of modified boron nitride is 15wt%, increasing the thermal conductivity to 0.63 W/(m·K), which is increased to 324% of that of pure epoxy resin. When the boron nitride filler mass fraction was 3wt%, the composites' tensile and flexural strengths climbed to 108% and 106% of those of pure epoxy resin, respectively.

Key words： epoxy resin boron nitride mechanical property thermal conductivity modification heat resistance

Published: Online: 2024-06-25

CLC number:

TB332

Fund:National Natural Science Foundation of China (52076080).

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	Articles by authors
	YU Tianfu
	LI Xiang
	YANG Xueming
	HU Zongjie
	JI Chang

Cite this article:

YU Tianfu,LI Xiang,YANG Xueming, et al. Improvement of Thermophysical Properties of Epoxy Resin Composites by Double Modification of Boron Nitride with Polydopamine Silane[J]. Materials Reports, 2024, 38(11): 22070092-6.

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http://www.mater-rep.com/EN/10.11896/cldb.22070092 OR http://www.mater-rep.com/EN/Y2024/V38/I11/22070092

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