| POLYMERS AND POLYMER MATRIX COMPOSITES |
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| Multi-scale Study of Mechanical Properties and Microstructure of PolyurethaneFoam Molding Process Based on the Regulation of MDI Content |
| ZHOU Huifeng, LIU Kefu, LIANG Lumin, HU Minghao, GUO Liuwei, ZHOU Yingke, PENG Jin, SONG Xudong*
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| School of Materials Science and Engineering, University of Technology Henan, Zhengzhou 450001, China |
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Abstract Polyurethane foam (PUF) polishing pads, serving as critical consumables in chemical mechanical polishing (CMP) for semiconductor wafers and electronic components, require synergistic optimization of hardness, toughness, and pore architecture to enhance polishing perfor-mance. This study systematically investigates the mechanistic effects of 4, 4′-diphenylmethane diisocyanate (MDI) content on the microstructure, physical properties, and mechanical behavior of PUF pads through thermal management of foam growth and comprehensive mechanical characterization. The experimental results show that when the MDI content increases from 15 phr to 40 phr, the compressive strength of PUF significantly increases from 0.25 MPa to 2.69 MPa (an increase of 976%), the tensile strength rises from 1.16 MPa to 2.85 MPa (an increase of 145%), the elongation at break decreases from 101.8% to 15.6% (a decrease of 85%), and the Shore hardness increases from 64.5 to 90.4 (an increase of 40%). Concurrently, the foam exhibits reduced pore size, enhanced pore uniformity, and densified cellular structures. These variations arise from intensified crosslinking reactions between MDI and polyether polyol, forming a highly crosslinked polyurethane network. By correlating MDI dosage with network architecture evolution, this work establishes a quantitative structure-property relationship and proposes a chemically controllable modification strategy, offering a theoretical framework and process optimization pathway for designing next-generation high-performance PUF CMP pads.
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Received: 10 May 2026
Published:
Online: 2026-05-18
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