时效时间和Sb添加对Sn-9Zn-3Bi/Cu焊点界面金属间化合物生长行为的影响

doi:10.11896/cldb. 23120193

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Abstract The intermetallic compounds(IMC) at the interface of lead-free solder joints play a key role in affecting the reliability of the solder joints. In this work, the effects of aging time and Sb addition on the morphology of IMC and corresponding growth kinetics of the Sn-9Zn-3Bi/Cu solder joint were studied by scanning electronic microscope (SEM). The results show that the thickness of the interfacial IMC at the Sn-9Zn-3Bi/Cu solder joint increase as the aging time increase, and the type of IMC was γ-Cu₅Zn₈ phase. After long period of aging, the addition of Sb reduced the thickness of the interface IMC at the Sn-9Zn-3Bi/Cu solder joint, and the growth coefficient of the IMC decreases from 0.67 μm/h^1/2 to 0.56 μm/h^1/2. As the aging time increases to 168 h, except for the existence of the interfacial γ-Cu₅Zn₈ phase, the Cu₆Sn₅ phase is formed near Cu substrate, and the diffusion interaction layer is formed near solder matrix too. The Sb element will diffuse into the Cu₆Sn₅ phase and exist in the form of solid solution.

Key words： aging time Sb addition Sn-9Zn-3Bi solder interfacial microstructure growth coefficient

Published: 25 March 2025 Online: 2025-03-24

CLC number:

TG453.9

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	Articles by authors
	TU Wenbin
	HU Zhihua
	ZOU Yurou
	LIU Guanpeng
	WANG Shanlin
	CHEN Yuhua

Cite this article:

TU Wenbin,HU Zhihua,ZOU Yurou, et al. The Effect of Aging Time and Sb Addition on Growth Behavior of Interfacial Intermetallic Compounds at Sn-9Zn-3Bi/Cu Solders Joints Interface[J]. Materials Reports, 2025, 39(6): 23120193-6.

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https://www.mater-rep.com/EN/10.11896/cldb. 23120193 OR https://www.mater-rep.com/EN/Y2025/V39/I6/23120193

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