高温高压法制备高导热金刚石/铜复合材料的研究现状

doi:10.11896/cldb.24080072

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Abstract Different from the previous reviews on various preparation techniques for diamond/copper composites, this paper focuses on the current research status of high thermal conductivity diamond/copper composites in the direction of high temperature and high pressure (HTHP) met-hod preparation technology. The HTHP method, by providing high temperature and ultra-high pressure conditions, can effectively solve the mate-rial densification and diamond graphitization problems. This paper reviews the key research areas in the preparation of diamond/copper compo-sites by the HTHP method, including sintering process, raw material particle size, diamond volume fraction, diamond surface coating, and the addition of alloying elements. Furthermore, with the combination of the HTHP method and infiltration technology, the interface bonding problem between diamond and copper has been alleviated to a certain extent, providing a direct diamond channel for heat transfer, which significantly improves the thermal conductivity of diamond/copper composites. Future exploration can be carried out in more detailed studies based on this foundation to promote the development of HTHP preparation technology in this field.

Key words： high temperature and high pressure diamond/copper composites high thermal conductivity diamond heat channel

Published: 25 September 2025 Online: 2025-09-11

CLC number:

TB333

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	Articles by authors
	TANG Lihui
	XIAO Changjiang
	ZHOU Bin
	LI Zhengxin

Cite this article:

TANG Lihui,XIAO Changjiang,ZHOU Bin, et al. Review on the Preparation of High Thermal Conductivity Diamond/Copper Composites by HTHP Method[J]. Materials Reports, 2025, 39(18): 24080072-6.

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https://www.mater-rep.com/EN/10.11896/cldb.24080072 OR https://www.mater-rep.com/EN/Y2025/V39/I18/24080072

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