RESEARCH PAPER |
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Microstructure and Property Evolution of Sn-58Bi Alloy During Continuous Extrusion |
YIN Jiancheng, ZHANG Baqi, LIU Lina, CHEN Yegao, WANG Liqiang, YANG Huan, ZHONG Yi
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School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 |
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Abstract The Sn-58Bi alloy wires were fabricated by continuous extrusion technology. The microstructure and property evolution of the Sn-58Bi alloy during continuous extrusion were researched. The results showed that Sn matrix was elongated along the extrusion direction and the Bi phase was in band-like distribution in friction-shearing region. The Bi phase seems like coarser cluster structure in the upsetting deformation region. The dynamic recrystallization began to occur and Bi phase turns into rosette structure in the adhesion region. The dynamic recrystallization was completed and resulted in finer recrystallization structure in the right-angle bending region. The Vickers hardness of Sn-58Bi alloy increased with the increasing deformation during continuous extrusion except in the right-angle bending region. The tensile strength and elongation of alloy increase with the increase of the extrusion ratio. Analysis has indicated that the fracture of Sn-58Bi alloy wire was caused by inter-phase separation between the tin and bismuth phase and broken of bismuth.
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Published: 25 June 2017
Online: 2018-05-08
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