环氧胶粘剂及其胶接界面热氧老化机理研究

doi:10.11896/j.issn.1005-023X.2017.012.022

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Abstract The thermal-oxidative aging mechanism of epoxy adhesive was studied by infrared spectroscopy, X-ray photoelectron spectroscopy and scanning electron microscope. The mechanical property of epoxy adhesive joint was tested and the effect of thermal oxygen environment on its mechanical property decrease was analyzed. Experimental results showed the main chemical reactions of epoxy adhesive during accelerated thermal aging were post cure reaction and oxidation reaction. During thermal aging, the OH group of epoxy adhesive was oxidized to aldehyde group, methylene was oxidized to amide. The mechanical properties of epoxy adhesive after thermal aging showed good resistance to aging, the adhesive strength was relatively stable as aging time lasted.

Key words： epoxy adhesive bonding interface accelerated aging thermal aging mechanism

Published: 25 June 2017 Online: 2018-05-08

CLC number:

TB324

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	Articles by authors
	ZHANG Huan
	XU Wen
	ZOU Shiwen
	ZHANG Xinlan

Cite this article:

ZHANG Huan,XU Wen,ZOU Shiwen, et al. Thermal-oxidative Aging Mechanism of Epoxy Adhesive and Its Interface[J]. Materials Reports, 2017, 31(12): 104-108.

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https://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2017.012.022 OR https://www.mater-rep.com/EN/Y2017/V31/I12/104

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