镀铜CF/ABS树脂复合材料的导电性能

doi:10.11896/j.issn.1005-023X.2018.10.004

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Abstract The copper-coated mesophase pitch-based carbon fibers (Cu-CF) were prepared by electroless copper plating for improving the conductivity of CF, and the Cu-CF reinforced ABS resin (Cu-CF/ABS) composites were prepared using hot-pressed method. The surface morphology and microcrystalline structure of Cu-CF were characterized by SEM, EDS and XRD. The relationship between the thickness of copper layers as well as the interface structure of Cu-CF and the conductivity of composites was investigated. The results showed that the electroless copper plating was a grain size growing and crystal structure compacting process for achieving copper layers on the surface of carbon fiber. The resistivity of the Cu-CF decreased rapidly as increasing the thickness of copper layers, and the resistivity of the Cu-CF slowed to a constant level when the thickness of copper layers over 695 nm. Moreover, the Cu-CF/ABS composites presented excellent conductivity of 5.87×10^-4 Ω·cm when the resultant Cu-CF (thickness of 632 nm) used as strengthening phases with volume fraction of 20%. Therefore, the Cu-CF/ABS composites showed a great potential application for conductive functional materials.

Key words： carbon fiber composites electroless copper plating microstructure electrical conductivity

Published: 25 May 2018 Online: 2018-07-06

CLC number:

TB332

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	Articles by authors
	ZHOU Mianhong
	CHEN Shilin
	YANG Jianxiao
	GUO Jianguang

Cite this article:

ZHOU Mianhong,CHEN Shilin,YANG Jianxiao, et al. Electrical Conductivity of Copper-coated CF/ABS Composites[J]. Materials Reports, 2018, 32(10): 1592-1596.

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https://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.10.004 OR https://www.mater-rep.com/EN/Y2018/V32/I10/1592

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