短切玻纤增强PEKK与BDM/DABPA共混体系固化反应动力学及断裂韧性

doi:10.11896/j.issn.1005-023X.2018.06.022

Abstract
Figure/Table
References
Related Citation (15)

Download:

Full Text ( PDF ) (1612KB)
Export: BibTeX | EndNote (RIS)

Abstract Diphenylmethyenebismaleimide (BDM) chain was extended by diallyl bisphenol A (DABPA). Short glass fiber reinforced polyether ketone ketones (PEKK-GF) was used to modify the BDM/DABPA resin. The curing kinetics of the BDM/DABPA resin modified by PEKK-GF was investigated by non-isothermal differential scanning calorimetry (DCS). Curing process of the modified resin was determined and some kinetic parameters were calculated. The mechanical properties of the modified resin were tested by universal tensile machine. The results showed that the impact strength of the cured modified resin was improved by 69%. The plan strain critical stress intensity factor (K_IC) and the plan strain critical strain energy release rate (G_IC) of the modified resin could reach 1.22 MPa·m^0.5and 295 J/m², increased by 21% and 59% respectively when 10 wt% PEKK-GF was used. Tensile strength increased from 85.21 MPa to 96.39 MPa and tensile modulus increased from 4.198 GPa to 4.531 GPa. Bending strength increased from 133.0 MPa to 140.4 MPa and bending modulus increased from 4.080 GPa to 4.251 GPa. The thermal stability was cha-racterized by dynamic mechanical analysis (DMA).The results showed that the glass transition temperature (T_g) of cured modified resin reached 263.5℃, which increased by 16.5 ℃. With these excellent performances, the modified resin may be applied to the fields of high temperature prepreg and adhesive.

Key words： polyether ketone ketones bismaleimide curing reaction kinetics fracture toughness

Published: 25 March 2018 Online: 2018-03-25

CLC number:

TQ314.2

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	LI Hongfeng
	QU Chunyan
	WANG Dezhi
	LIU Zhongliang
	GU Jiyou
	ZHANG Yang

Cite this article:

LI Hongfeng,QU Chunyan,WANG Dezhi, et al. Curing Kinetics and Fracture Toughness of BDM/DABPA System Modified by Short Glass Fiber Reinforced Polyether Ketone Ketones (PEKK-GF)[J]. Materials Reports, 2018, 32(6): 971-976.

URL:

https://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.06.022 OR https://www.mater-rep.com/EN/Y2018/V32/I6/971

1 Takao I, Tsutomu N, Wakihci F, et al. Modification of bismalei-mide resin by Poly(phthaloyldiphenylether) and therelated copolymes[J].Journal of Applied Polymer Science,1998,67(5):769.
2 Yuan Q, Huang F, Jiao Y. Characterization of modified bismalei-mide resin[J].Journal of Applied Polymer Science,2015,62(62):459.
3 Meng Q H, Gu Y J, Liang G Z, et al. Modification of bismaleimide resin by hyperbranched polysiloxane[J].Acta Polymerica Sinica,2010(10):1245(in Chinese).
孟庆辉,顾媛娟,梁国正,等.超支化聚硅氧烷改性双马来酰亚胺树脂的研究[J].高分子学报,2010(10):1245.
4 Wang J L, Wang C. Study of cyanate ester resin based composite modified by nano-SiC[J].Materials Review B:Research Papers,2010,24(5):44(in Chinese).
王君龙,王闯.纳米SiC改性氰酸酯树脂基复合材料的研究[J].材料导报:研究篇,2010,24(5):44.
5 Wu Y, Zhang Q Y, Chen Y. An effective modification of bismalei-mide resin with PES/PEK[J].Journal of Northwestern Polytechnical University,2012,30(1):149(in Chinese).
吴寅,张秋禹,陈营.PES/PEK改性BMI树脂的性能研究[J].西北工业大学学报,2012,30(1):149.
6 Li H F, Wang D Z, Zhao L W, et al. Study on Diallyl biphenol a modified bismaleimide resin toughened with polyamide-imide[J].China Adhesives,2013,22(7):5(in Chinese).
李洪峰,王德志,赵立伟,等.聚酰胺酰亚胺树脂对BMI/DP共聚树脂的增韧研究[J].中国胶黏剂,2013,22(7):5.
7 Ding F C, Chen Q S, Lai L, et al. Bismaleimide (BMI) resin modified by PEEK bearing pendant reactive propenyl groups[J].Advanced Materials Research,2011,197:1299.
8 Gan D, Lu S, Wang Z. Synthesis and characterization of poly(ether ketone ketone)(PEKK)/sodium sulfonated poly(arylene ether ketone)(S-PAEK) block copolymers[J].Polymer International,2001,50(7):812.
9 Derisi B, Hoa S V, Xu D, et al. Mechanical behavior of Carbon/PEKK thermoplastic composite tube under bending load[J].Journal of Thermoplastic Composite,2011,24(1):29.
10 Cao T, Yuan L, Gu A, et al. Fabrication and origin of new flame retarding bismaleimide resin system with low dielectric constant and loss based on microencapsulated hexaphenoxycyclotriphosphazene in low phosphorus content[J].Polymer Degradation and Stability,2015,121(7):157.
11 Chen X, Gu A, Liang G, et al. Novel low phosphorus-content bismaleimide resin system with outstanding flame retardancy and low dielectric loss[J].Polymer Degradation and Stability,2012,97(5):698.
12 Fallahi A, Rajabi L, Taromi F A. DSC analysis of thermosetting polyimides based on three bismaleimide resin eutectic mixtures[J].Iranian Polymer Journal,2011,20:161.
13 Wu G, Kou K, Li N, et al. Electrically conductive adhesive based on bismaleimide-triazine resin filled with microcoiled carbon fibers[J].Journal of Applied Polymer Science,2013,128(2):1164.
14 Wu Y, Zhang Q Y, Chen Y, et al. Research on modification of bismaleimide resin by polyerketone[J].Materials Review B:Research Papers,2013,27(1):65(in Chinese).
吴寅,张秋禹,陈营.聚醚酮改性双马来酰亚胺树脂的研究[J].材料导报:研究篇,2013,27(1):65.
15 Gao K, Sun B G, Yang Z Y, et al. Improvement research progress in the dielectric properties of resin matrix for wave-transparent compo-site[J].Journal of Functional Materials,2015,46(S2):44(in Chinese).
高坤,孙宝岗,杨智勇,等.透波复合材料用树脂基体介电性能的改善研究进展[J].功能材料,2015,46(S2):44.
16 Qu C Y, Zhao L W, Wang D Z. Study on bismaleimide resin containing ether and ketone groups modified by diallyl bisphenol[J].Engineering Plastics Application,2013,41(8):83(in Chinese).
曲春艳,赵立伟,王德志.二烯丙基双酚A改性醚酮结构双马来酰亚胺树脂的研究[J].工程塑料应用,2013,41(8):83.
17 Ou Q R, Ji P J, Xiao J, et al. Studied on properties of bisphenol A cyanate ester modified by epoxy resin[J].Journal of Functional Materials,2015,46(S2):129(in Chinese).
欧秋仁,嵇培军,肖军,等.环氧树脂改性双酚A型氰酸酯树脂的性能研究[J].功能材料,2015,46(S2):129.
18 Fang H Q, Liang G Z,Wang J L, et al.Development of toughening modification of cyanate ester resin[J].Materials Review,2004,18(3):47(in Chinese).
房红强,梁国正,王结良,等.氰酸酯树脂增韧改性的研究进展[J].材料导报,2004,18(3):47.
19 Shang guan J H, Liao G X, Liu C, et al. The preparation and pro-perties of PPENK modified BMI resin[J].Materials Science and Engineering,2012,28(1):89(in Chinese).
上官久桓,廖功雄,刘程,等.PPENK增韧改性BMI树脂体系的制备与性能[J].高分子材料科学与工程,2012,28(1):89.
20 Sue H J, Bertram J L, Garcia M, et al. Fracture behavior of core-shell rubber-modified crosslinkable epoxy thermoplastics[J].Colloid and Polymer Science,1994,272(4):456.
21 Zhao L, Hu X. A variable reaction order model for prediction of curing kinetics of thermosetting polymers[J].Polymer,2007,48(20):6125.
22 Qu C Y, Zhao L W, Wang D Z, et al. Bis [4-(4-maleimidephen-oxy) phenyl]-propane/N,N-4,4'-Bismaleimido-diphenylmethyene blend modified with diallyl bisphenol A[J].Journal of Applied Polymer Science,2014,131:12.
23 Kissinger H E. Reaction kinetics in differential thermal analysis[J].Analytical Chemistry,1957,29(11):1702.
24 Wei G X, Sue H J. Fracture mechanis in preformed polyphenylene oxide particle-modified bismaleimide resins[J].Journal of Applied Polymer Science,1999,74(10):2539.
25 Qin H H, Mather P T, Baek J B.et al. Modification of bisphenol-A based biamaleimide resin (BPA-BMI) with an allyl-terminated hyperbranched polyimide (AT-PAEKI)[J].Polymer,2006,47(8):2813.