RESEARCH PAPER |
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Optical Properties of Ordered Zigzag Silicon Nanowire Arrays Fabricated by Alternate Etching |
Xiao HE1,Yuxin ZOU1,Jiajia QIU1,Xi YANG2,Shaoyuan LI1,Wenhui MA1
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1 Faculty of Metallurgical and Energy Engineering/State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization,Kunming University of Science and Technology,Kunming 650093 2 Yunnan Provincial Energy Research Institute Co. Ltd.,Kunming 650228 |
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Abstract With the method of metal-catalytic chemical etching (MCCE), when employing metal Ag as catalyst, zigzag silicon nanowire arrays were fabricated by conducting alternate etching experiments on P(111) silicon substrate in HF and H2O2 systems. Scanning electron microscope (SEM) was adopted to characterize the morphology of silicon nanowires. The mutual effect of HF and H2O2 solution’s concentration on the etching direction of silicon nanowires was investigated, and isotropic etching and anisotropic etching were intensified through respectively adjusting and controlling the concentration of HF and H2O2 solution, making it possible that the etching direction can make rapid response to the solution concentration during the alternate etching process. Zigzag silicon nanowires with highly adjustable etching direction were fabricated when conducting alternate etching experiments in solution Ⅰ([HF]=2.3 mol/L,[H2O2]=0.4 mol/L) and solution Ⅱ([HF]=9.2 mol/L,[H2O2]=0.04 mol/L). The anti-reflection properties of zigzag silicon nanowires were measured by UV-Vis spectrophotometer, the lowest reflectivity was 5.9%, which shows a good prospect for photovoltaic applications. Because of the high controllability of the nanowires morphology, it has a great application prospect in the field of microelectronic devices.
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Published: 25 January 2018
Online: 2018-01-25
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SEM images of the section of silicon nanowires etched in single solution:(a)[HF]=4.6 mol/L, [H2O2]=0.04 mol/L;(b)[HF]=4.6 mol/L, [H2O2]=0.4 mol/L
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Schematic diagram for the fabrication of zigzag silicon nanowires by alternate etching
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Section images of silicon nanowires fabricated when etching in different alternate frequency of solution Ⅰ([HF]=4.6 mol/L, [H2O2]=0.4 mol/L) and solution Ⅱ([HF]=4.6 mol/L, [H2O2]=0.04 mol/L) for 30 min: (a)5 min—5 min—5 min—10 min—5 min;(b)10×3 min
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Section images of silicon nanowires fabricated when etching under different alternate frequency of solution Ⅰ([HF]=2.3 mol/L, [H2O2]=0.4 mol/L) and solution Ⅱ([HF]=9.2 mol/L, [H2O2]=0.04 mol/L) for 30 min: (a)5 min—5 min—5 min—10 min—5 min; (b)10×3 min;(c)30×1 min
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Reflection spectra of untreated silicon wafer and different structure of SiNWs (200—1 100 nm)
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Top-view SEM images of different SiNWS arrays:(a)zigzag SiNWs; (b)vertically-aligned SiNWs
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