高体积比SiCp/A356复合材料真空扩散钎焊接头组织与性能研究*

doi:10.11896/j.issn.1005-023X.2017.022.015

Abstract
Figure/Table
References
Related Citation (15)

Download:

Full Text ( PDF ) (611KB)
Export: BibTeX | EndNote (RIS)

Abstract Using (Al-33.3Cu-6.0Mg)-xNi (wt.% x=0, 0.5, 1.0, 2.0, 3.0, 4.0, 5.0) filler metal foils obtained by rapidly melt-spun technique, vacuum brazed joints of 55% SiCp/A356 composites with and without electroless Ni-P alloy coating were obtained, and their microstructures and bonding strength were analyzed by SEM, EDS and shearing test respectively. Results show that the solidus-liquidus temperatures of the developed foils are close to 504—522 ℃. Without Ni-P alloy coating and using(Al-33.3Cu-6.0Mg)-3Ni filler metal, compact joints were obtained at 570 ℃ and soaking time of 30 min and its shear strength achieved to 64.97 MPa. In the case, proper interdiffusion and dissolution between A356 matrix/filler metal interfaces occurred rather than defect of melting corrosion at 585 ℃, and reaction layer was obtained along the part of filler metal/SiCp interfaces because of chemical reaction with active Mg element effect. While with Ni-P alloy coating, compact reaction layers rich in Al and Ni elements tended to be formed along the A356 matrix/Ni-P alloy coating/filler metal foil interfaces at 570 ℃ and soaking time of 30 min. Consequently, the joint adhesion was improved significantly and a higher shear strength of 79.96 MPa was obtained by using (Al-33.3Cu-6.0Mg)-4Ni filler metal foil.

Key words： SiCp/Al composites electroless plated Ni-P alloy coating vacuum brazing microstructure

Published: Online: 2018-05-08

CLC number:

TG454

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	WANG Peng
	GAO Zeng
	CHENG Dongfeng
	NIU Jitai

Cite this article:

WANG Peng,GAO Zeng,CHENG Dongfeng, et al. Investigation on the Microstructures and Properties of Vacuum Diffusion Brazed Joints for SiCp/A356 Composites with High SiC Content[J]. Materials Reports, 2017, 31(22): 75-78.

URL:

https://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2017.022.015 OR https://www.mater-rep.com/EN/Y2017/V31/I22/75

1 Yu Z H, Zhang J Y, Zhou X L, et al. Research and development on thermal conductivity of SiC/Al composites applied to electronic packaging[J]. Met Funct Mater, 2009,16(1):59.
2 Guo M, Liu J, Li Y. Microstructure and properties of SiC p/Al electronic packaging shell produced by liquid-solid separation[J]. Trans Nonferr Met Soc China, 2014,24(4):1039.
3 Li L Q, Zuo Z C, Tao W, et al. Welded joints fracture behavior of laser in-situ welding of high volume fraction SiCp/2024Al MMC[J]. Trans China Weld Inst, 2012(4):61(in Chinese).
李俐群, 左智成, 陶汪, 等. 高比分SiCp/2024铝基复合材料激光原位焊接头断裂行为[J]. 焊接学报, 2012(4):61.
4 Lei Y C, Hu W X, Xue H L, et al. Influence of Ti-Al-Si-Mg on microstructure and mechanical properties of plasma arc in-suit welded joint of SiCp/Al MMCS[J]. Trans China Weld Inst, 2011,32(5):9(in Chinese).
雷玉成, 胡文祥, 薛厚禄, 等. Ti-Al-Si-Mg对SiCp/Al基复合材料等离子弧原位焊接焊缝组织和性能的影响[J]. 焊接学报, 2011,32(5):9.
5 Wang B, Jiang S S, Zhang K F. Pulse current auxiliary TLP diffusion bonding of SiCp/2024Al composite sheet using mixed Al-Cu-Ti powder interlayer[J]. Int J Adv Manuf Technol, 2013,65(9-12):1779.
6 Wang P, Xu D X, Cheng D F, et al. Active brazing filler metal on SiC particle reinforced aluminium matrix composites[J]. Sci Technol Weld Join, 2015,20(5):361.
7 Wang D, Wang Q Z, Xiao B L, et al. Achieving friction stir welded SiCp/Al-Cu-Mg composite joint of nearly equal strength to base material at high welding speed[J]. Mater Sci Eng A, 2014,589(2):271.
8 Wang P, Gao Z, Niu J. Micro-nano filler metal foil on vacuum brazing of SiCp/Al composites[J]. Appl Phys A, 2016,122(6):592.
9 Su Y, Chen Y Q, Ding H L, et al. Microstructure and precipitation process of rapidly solidified Al-Cu-Mg-Fe-Ni alloy[J]. Chin J Rare Met, 2002,26(4):253(in Chinese).
苏勇, 陈翌庆, 丁厚福, 等. 快速凝固Al-Cu-Mg-Fe-Ni合金的显微组织和析出过程[J]. 稀有金属, 2002,26(4):253.
10 Aburada T, Fitz-Gerald J M, Scully J R. Pitting and dealloying of solute-Rich Al-Cu-Mg-based amorphous alloys: Effect of alloying with minor concentrations of nickel[J]. J Electrochem Soc, 2011,158(9):C253.
11 Aburada T, ünlü N, Fitz-Gerald J M, et al. Effect of Ni as a minority alloying element on the corrosion behavior in Al-Cu-Mg-(Ni) metallic glasses[J]. Scr Mater, 2008,58(8):623.
12 Fang M, Hu L, Yang L, et al. Electroless coating and growth kinetics of Ni-P alloy film on SiCp/Al composite with high SiC volume fraction[J]. Trans Nonferr Met Soc China, 2016,26(3):799.
13 Yadav T P, Mukhopadhyay N K, Tiwari R S, et al. Formation of Al3Ni2-type nanocrystalline 3 phases in the Al-Cu-Ni system by mechanical alloying[J]. Phil Mag Lett, 2007,80(87):781.
14 车荫昌,梁英教. 无机物热力学数据手册[M]. 沈阳:东北大学出版社, 1993.
15 Choi W K, Lee H M. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate[J]. J Electron Mater, 2000,29(10):1207.
16 Yi Y C, Zhou G, Ju W P, et al. Effect of alloying element on the wettability and corrosion resistance of low-tin solders[J]. Trans China Weld Inst, 1990(1):50(in Chinese).
易蕴琛, 周钢, 鞠为平, 等. 合金元素对低锡钎料润湿性和抗腐蚀性能的影响[J]. 焊接学报, 1990(1):50.