Cu7-xNixTi3合金显微组织、凝固过程及与氧化铝的界面反应

doi:10.11896/cldb.25010159

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Abstract To develop high-performance and low-cost Cu-Ti based brazing filler materials, the effect of Ni content on the as-cast microstructure and soli-dification process of the Cu_7-xNi_xTi₃ alloys and their interface reaction with alumina were investigated in the present work. It was found that all the Cu_7-xNi_xTi₃ alloys with addition (atomic fraction) of 20%—50% Ni are mainly composed of uniformly precipitated τ₁-CuNiTi phase. Ni content in the τ₁ phase increases with it in the alloy. At the same time, the FCC and Cu₄Ti phases, which exists in alloys with 20%—30% Ni, gra-dually decrease until they disappeared, and the alloy hardness gradually increases. When Ni content is ≥40%, the τ₆-CuNi₂Ti phase appears and gradually increases in the alloy. Furthermore, the increase of Ni content raises the melting point of Cu_7-xNi_xTi₃ alloys to 1 187 ℃, but shor-tens the melting range to 35 ℃. After melting at 1 200 ℃, the liquid Cu_7-xNi_xTi₃ alloy has good wettability with alumina. When 20%—30% Ni is added, a continuous TiO₂ and Ni₂TiO reaction layer with moderate thickness forms at the reacted interface. These findings will provide a theoretical basis for designing economical Cu-Ni-Ti based brazing filler materials.

Key words： Cu-Ni-Ti alumina solidification microstructure brazing interfacial reaction thermodynamic calculation

Published: 10 February 2026 Online: 2026-02-13

CLC number:

TG113.12

Corresponding Authors: wucj@cczu.edu.cn

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	Articles by authors
	CAI Yilin
	WU Changjun
	LIU Ya
	ZHU Xiangying
	SU Xuping

Cite this article:

CAI Yilin,WU Changjun,LIU Ya, et al. Microstructure,Solidification Process and Interface Reaction with Alumina of the Cu_7-xNi_xTi₃ Alloys[J]. Materials Reports, 2026, 40(3): 25010159-7.

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https://www.mater-rep.com/EN/10.11896/cldb.25010159 OR https://www.mater-rep.com/EN/Y2026/V40/I3/25010159

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