微电子封装用芯片散热界面材料研究进展

doi:10.11896/cldb.24100134

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Abstract Thermal interface materials (TIMs) are critical components to ensure the proper functioning of the chips, primarily by efficiently dissipating the heat continuously generated during chip operation. This review provides a comprehensive analysis of the classification and composition of TIMs, with an in-depth examination of the fabrication techniques, fundamental properties, and recent advancements of two different categories of TIMs. Additionally, this review addresses the challenges encountered during the service life of TIMs, elucidates the mechanisms underlying thermal conductivity in these materials, and outlines the measurement methods used to assess the heat dissipation efficiency of chips. In mobile electronic devices, TIMs are trending toward higher thermal conductivity, lighter weight, and more environmentally sustainable manufacturing and usage practices throughout their lifecycle.

Key words： thermal interface material chip cooling microelectronic packaging high thermal conductivity

Published: 25 February 2026 Online: 2026-02-13

CLC number:	TB33
	TB34

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	Articles by authors
	PENG Haoyan
	XUE Yunlong
	WANG Xiufeng

Cite this article:

PENG Haoyan,XUE Yunlong,WANG Xiufeng. Research Progress on Thermal Interface Materials for Microelectronic Packaging[J]. Materials Reports, 2026, 40(4): 24100134-14.

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https://www.mater-rep.com/EN/10.11896/cldb.24100134 OR https://www.mater-rep.com/EN/Y2026/V40/I4/24100134

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