| POLYMERS AND POLYMER MATRIX COMPOSITES |
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| Research Progress on the Application of Nano Conductive Fillers in Conductive Adhesives |
| LI Ping1,2,*, NI Yanrong1,2, LI Chengbin1,2, ZHOU Ruizhe1,2, XU Sishang1
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1 School of Cable Engineering, Henan Institute of Technology, Xinxiang 453003, Henan, China
2 Henan Key Laboratory of Cable Structure and Materials, School of Cable Engineering, Henan Institute of Technology, Xinxiang 453003, Henan, China |
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Abstract Conductive adhesive, composed of a resin matrix and conductive fillers, is an advanced microelectronic component connection material. With its advantages of environmental protection, low curing temperature, and simple application process, it has been widely used in microelectronic fields such as liquid crystal panels, chip components, printed circuits, and thin-film transistors. However, the higher resistivity inherent in traditional conductive adhesives has impeded its further enhancements in performance. The incorporation of nanoscale conductive fillers with distinctive size and surface effects in the conductive adhesive can effectively reduce its resistivity and simultaneously improve its mechanical properties, thereby emerging as a pivotal technique for enhancing the performance of these adhesives. This paper deeply explores the advancements in the application of carbon-based, silver-based, conductive polymer-based and composite nano-fillers within conductive adhesives. The effects of filler types, morphologies, and surface properties on the performance of conductive adhesives were analyzed, and the mechanisms of electrical conductivity were elucidated. Furthermore, The future development direction of conductive adhesives and their fillers were proposed. These should provide theoretical guidance and practical reference for the technological innovation and industrial application of conductive adhesives.
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Published: 10 August 2025
Online: 2025-08-13
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