电子级超细树枝状铜粉的抗氧化性研究

doi:10.11896/cldb.21090292

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Abstract Ultrafine copper powder is widely employed as materials in electronic pastes. Due to its large specific surface area and high surface activity, it is easy to be oxidized to produce copper oxide or cuprous oxide, thereby reducing its conductivity and activity. In this work, surface treatment of the electronic grade ultrafine dendritic copper powder was conducted by the combination of benzotriazole and surface treatment agent. Through high temperature oxidation, conductivity, morphology and substance equivalence analysis, the effect of surface treatment agent on the oxidation resistance, conductivity, morphology and phase structure of copper powder were studied. The results suggest that the conductivity of the copper powder after the surface treatment at 100—200 ℃ was improved to different degrees than that of the untreated copper powder. The sample also exhibited better conductivity and still maintained the resistivity of 0.224 Ω·cm. Besides, no obvious copper oxide or cuprous oxide produced, and collapse of the dendritic shape structure was observed. Therefore, benefitting from the introduction of the benzotriazole and surface treatment agent, the oxidation resistance of the electronic grade ultrafine dendritic copper powder is considerably improved, which could meet the requirement of conductive fillers for medium-low temperature electronic pastes.

Key words： electronic paste ultra-fine copper powder dendritic oxidation resistance conductivity

Published: 10 April 2023 Online: 2023-04-07

CLC number:

TF80

Fund:National Natural Science Foundation of China (52064028), the Yunnan Provincial Basic Research Program Key Project (202101AS070013), and the Yunnan Provincial Central Guidance and Local Special Project (202107AC110009).

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	Articles by authors
	FANG Yachao
	PAN Mingxi
	HUANG Hui
	HE Yapeng
	ZHANG Panpan
	YANG Congqing
	GUO Zhongcheng
	CHEN Buming

Cite this article:

FANG Yachao,PAN Mingxi,HUANG Hui, et al. Study on the Oxidation Resistance of Electronic Grade Ultrafine Dendritic Copper Powder[J]. Materials Reports, 2023, 37(7): 21090292-7.

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http://www.mater-rep.com/EN/10.11896/cldb.21090292 OR http://www.mater-rep.com/EN/Y2023/V37/I7/21090292

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