柔性基底上金属薄膜的失效行为及界面能测试方法研究进展

doi:10.11896/cldb.19050230

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Abstract The composite structure of thin metal films deposited on flexible polymer substrates has advantages of both polymers and metals, including flexibility and lightness of polymers, as well as excellent conductivity and electromagnetic shielding of metals. Flexible substrates-metal film systems are favored for their high ductility, high flexibility, high production efficiency, good electrical properties, biocompatibility, and other advantages. In all applications, the performance, reliability and durability are directly related to the good interfacial adhesion between the film and the substrate. The mechanical properties and interface bonding properties of film-substrate structures play an important role in the service life of rela-ted devices.
However, in practical applications, thin film-substrate composite structures suffer from complex loads, such as stretching, torsion, bending, etc. Although flexible substrates can bear large deformation, metal films cannot, which may lead various forms of damage to the film-substrate structures, including three main failure modes: interfacial delamination, film buckling and film fracture. On the one hand, these damages will se-riously affect the electrical, magnetic, optical and other physical properties of the film, and the interface adhesion between the film and substrate plays a key role in the occurrence and development of the film failure. On the other hand, for different failure modes, it can be fully used to test the mechanical properties and interface adhesion energy of thin films. In recent years, the failure behavior and interfacial adhesion test of monolayer, bilayer and multilayer membrane systems on flexible substrates have attracted wide attention.
Forsingle-layer film systems on flexible substrates, the failure behaviors and fracture mechanisms of films and interfaces have been studied deeply. For multilayer metal film systems, the combination of metal layers with different properties can improve adhesion, corrosion resistance or thermal stability. The influence mechanism of size effect of multilayer, the interlayer combination of different materials and the mechanical response of interface have become the focus of scholars in recent years. In the past, as to the interface adhesion energy between thin films and substrates, researches mainly focused on rigid substrates. While in recent years, scholars have proposed new and effective methods to determine the interface adhesion energy of flexible substrates-metal film systems.
This paper reviews the latest research progress on the failure behavior and interface failure of micro-nano metal films on flexible substrates. In particular, how to use the buckling failure of thin films to measure the properties of thin films and determine the interface adhesion energy is discussed. Finally, the problems and prospects of the research in this field are prospected, so as to provide references for material selection and structural design of new flexible film-substrate systems.

Key words： flexible substrate metal films film-substrate interface failure buckling cracking interfacial adhesion energy deposition

Published: 15 January 2020

CLC number:

O647.4

Fund:This work was financially supported by the National Natural Science Foundation of China (11602083), the Natural Science Foundation of Hunan Province (2016JJ6044).

About author:: Xiuli Xue received her Ph.D. degree in solid mechanics from Tianjin University in 2014. She is currently an associate professor in Hunan University of Science & Technology. Her research interests are mechanics of thin film and smart materials.
Chaofeng Zeng received his Ph.D. degree in geotechnical engineering from Tianjin University in 2015. He is currently an associate professor in Hunan University of Science and Technology, and a visiting fellow in University of Southampton. His research interests are mechanics of soft soils and smart materials. He received the Outstanding Reviewer Award from Elsevier in recognition of his contribution made to the quality of the Computers and Geotechnics. He now leads more than 10 research projects as a principal investigator, including funds coming from National Natural Science Foundation of China, and the China Postdoctoral Science Foundation. In recent years, he has published more than 50 research papers in many international journals and domestic journals.

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Cite this article:

XUE Xiuli,WANG Shibin,ZENG Chaofeng, et al. Failure Behavior and Test Method of Interface Energy of Thin Metal Films on Flexible Substrates: a Review[J]. Materials Reports, 2020, 34(1): 1050-1058.

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http://www.mater-rep.com/EN/10.11896/cldb.19050230 OR http://www.mater-rep.com/EN/Y2020/V34/I1/1050

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