Application of Electrically-conductive (Cu, Mn)3O4 Contact Layer on Anode-Side of SOEC
HUANG Xurui1, YU Yutian2,*, LEI Jinyong1, HAO Jingxuan2, YU Chuanxin2,3, PAN Jun1, YANG Yiping1, LIAO Zihao1, GUAN Chengzhi2, WANG Jianqiang2
1 Guangzhou Power Supply Bureau, Guangdong Power Grid Co., Ltd., Guangzhou 510600, China 2 Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201800, China 3 College of Environmental Science and Engineering, Donghua University, Shanghai 201620, China
Abstract: In SOEC stack, several issues including high contact resistance, oxidation of interconnect surface as well as anode‘ Cr poisoning’ exist between the interconnect and anode, which can significantly result in performance degradation for the stack. In this study, the (Cu, Mn)3O4-based spinel was evaluated as the SOEC anode-side contact material. A mixture of Mn and CuO was thermally converted into the spinel layer to lower the sintering temperature and enhance the performance. A simulated interconnect/contact/anode cell was fabricated to investigate the effectiveness of the reactively-sintered contact layer on the electrical performance and chemical compatibility. The tested cell exhibited extremely stable behavior with an ASR of only 20.13—20.32 mΩ·cm2. While the Cr-rich oxide scale was effectively reduced, no obvious interdiffusion was observed between the contact layer and adjacent cell component at each interface. The (Cu, Mn)3O4 contact layer improved the electrochemical performance of the test cell, significantly reduced the contact resistance.
通讯作者:
*余喻天,中国科学院上海应用物理研究所工程师。2014年南昌航空大学机械系本科毕业,2020年美国田纳西理工大学博士毕业后到中国科学院上海应用物理研究所工作至今。目前主要从事高温固体氧化物电解池等方面的研究工作。发表论文十余篇,包括International Journal of Hydrogen、Journal of the Eelectrochemical Society、Solid State Ionics、Coatings、FuelCells等。yuyutian@sinap.ac.cn
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