Cu/Sn37Pb/Cu钎焊接头界面微观结构及其剪切性能

doi:10.11896/j.issn.1005-023X.2018.12.012

Abstract
Figure/Table
References
Related Citation (9)

Download:

Full Text ( PDF ) (4867KB)
Export: BibTeX | EndNote (RIS)

Abstract This work aims to deeply investigate the influences of a high volume fraction of interfacial intermetallic compound (IMC) upon the shear properties and fractured surface morphologies of the Cu/Sn37Pb/Cu solder joints. We conducted the shear-fracture test, explored and analyzed the IMCs’ growths, shear strengths and fracture modes of a series of Cu/Sn37Pb/Cu solder joints which differed in reflowing time and aging time. Our experiment observed the gradual thickening and flattening of the interfacial Cu₃Sn layer as well as the increasing and enlarging Kirkendall voids at the Cu₃Sn/Cu interface as the aging treatment processed. The thickening of the interfacial Cu₃Sn layer led to an increase → decrease trend of the joint’s shear strength, which might be attri-buted to the excessive thickness of the brittle IMC layer or the grain coarsening of Sn-rish phase and Pb-rich phase. The solder joints with shorter aging time and reflowing time had a relatively higher volume fraction of bulk solder and displayed a ductile fracture mode. However, as the aging time or reflowing time were prolonged, the fracture mode gradually changed into a ductile-brittle mixed failure mode, and to a ductile fracture mode finally.

Key words： solder joint aging treatment reflowing time Kirkendall void shear strength fracture mode

Published: 20 July 2018

CLC number:

TG425

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	WAN Yongqiang
	HU Xiaowu
	XU Tao
	LI Yulong
	JIANG Xiongxin

Cite this article:

WAN Yongqiang,HU Xiaowu,XU Tao, et al. Interface Microstructure and Shear Properties of Cu/Sn37Pb/Cu Solder Joints[J]. Materials Reports, 2018, 32(12): 2003-2007.

URL:

http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.12.012 OR http://www.mater-rep.com/EN/Y2018/V32/I12/2003

1 Wang X M. Experimental study on tensile strength and fracture mode of solder joint IMC Layer[D]. Beijing: Beijing industry university,2012(in Chinese).
王旭明.焊锡接点IMC层拉伸强度与断裂模式实验研究[D].北京:北京工业大学,2012.
2 Choudhury S F, Ladani L. Grain growth orientation and anisotropy in Cu₆Sn₅ intermetallic: Nanoindentation and electron backscatter diffraction analysis[J]. Electronic Materials,2014,43(4):996.
3 Choudhury S F, Ladani L. Effect of intermetallic compounds on the thermo-mechanical fatigue life of three-dimensional integrated circuit package micro solder bumps: Finite element analysis and study[J]. Journal of Electronic Packaging,2015,137(4):64.
4 Zhang L, Xue S B, Zeng G, et al. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging[J]. Journal of Alloys and Compounds,2012,510:38.
5 Li H, An R, Wang C, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging[J]. Journal of Alloys and Compounds,2015,634:94.
6 Kar A, Ghosh Ma, Ray A K, et al. Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy[J]. Materials Science and Engineering A,2007,459:69.
7 Kim D G, Jang H S, Kim J W, et al. Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging[J]. Journal of Materials Science: Materials in Electronics,2005,16(9):603.
8 Shih Po-Cheng, Lin Kwang-Lung. Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste[J]. Journal of Materials Science,2007,42(8):2574.
9 Bhat K N, Prabhu K N, Satyanarayan. Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds[J]. Journal of Materials: Materials in Electronics,2014,25:864.
10 Hu Xiaowu, Li Yulong, Liu Yong. Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging[J]. Microelectronics Reliability,2014,54(8):1575.
11 Zhu Q S, Guo J J, Shang P J, et al. Effects of aging on interfacial microstructure and reliability between SnAgCu solder and FeNi/Cu UBM[J]. Advanced Engineering Materials,2010,12(6):497.
12 Deng X, Piotrowski G, Williams J J, et al. Influence of initial morphology and thickness of Cu₆Sn₅ and Cu₃Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints[J]. Journal of Materials,2003,32(12):1403.
13 Liu Tao-Chi, Liu Chien-Min, et.al. Eliminate Kirkendall voids in solder reactions on nanotwinned copper[J]. Scripta Materialia,2013,68:241
14 Hu Xiaowu, Ke Zunrong. Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging[J]. Journal of Materials: Materials in Electronics,2014,25:936.
15 Zou J,Wu F S,Wang B. The trouble of Kirkendall voids in the micro-solder joints of electronic packaging[J]. Electronic Technology,2010,31(1):1(in Chinese).
邹建,吴丰顺,王波.电子封装微焊点中的柯肯达尔孔洞问题[J].电子工艺技术,2010,31(1):1.
16 Xing F, Yao J, Liang J, et al. Influence of intermetallic growth on the mechanical properties of Zn-Sn-Cu-Bi/Cu solder joints[J]. Journal of Alloys and Compounds,2015,649:1053.
17 Chen Y J, Chung C K, Yang C R, et al. Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics[J]. Microelectronic Reliability,2013,53(1):47.
18 Lee H T, Lin H S, Lee C S, et al. Reliability of Sn-Ag-Sb lead-free solder joints[J]. Materials Scienceand Engineering A,2005,407:36.
19 Soud Farhan Choudhury, Leila Ladani.Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis[J]. Journal of Alloys and Compounds,2016,680(25):665.
20 Lee H T, Hu S Y, Hong T F, et al. The shear strength and fracture behavior of Sn-Ag-xSb solder Joints with Au/Ni-P/Cu UBM[J]. Journal of Electronic Materials,2008,37(6):867.
21 Talebanpour B, Huang Z, Chen Z, et al. Effect of joint scale and processing on the fracture of Sn-3Ag-0.5Cu solder joints: Application to micro-bumps in 3D packages[J].Journal of Electronic Materials,2015,45(1):57.
22 Hu Xiaowu, Chen Wenjing, Yu Xiao.Shear strengths and fracture behaviors of Cu/Sn37Pb/Cu soldered joints subjected to different displacement rates[J]. Journal of Alloys and Compounds,2014,600:13.