INORGANIC MATERIALS AND CERAMIC MATRIX COMPOSITES |
|
|
|
|
|
Low Temperature Co-fired Microwave Dielectric Ceramics with Low Dielectric Constant: a Review |
CHEN Guohua1,2,*, HUANG Binghong1
|
1 School of Material Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, Guangxi, China 2 Guangxi Key Laboratory of Information Materials, Guilin University of Electronic Technology, Guilin 541004, Guangxi, China |
|
|
Abstract With the explosive increase of global mobile data and the rapid development of global satellite positioning system (GPS) and other wireless communication positioning means, microwave dielectric ceramics, as vital dielectric materials, can bear a variety of high-frequency signals and microwave signals, and are developing towards high-frequency and signal high-frequency adjustability. Lightweight, high performance and low loss are higher requirements for microwave dielectric ceramic materials in the era of big data. Low temperature co-fired ceramic (LTCC) technology has become the mainstream of active/passive component packaging with excellent thermal and electrical properties as well as an advanced preparation process, which is widely used in electronic devices and circuit packaging. In practice applications, for microwave electronic substrates, low permittivity effectively avoids signal delays and ensures efficient transmission rates. Materials with high quality factors (Q×f≥5 000 GHz) can increase frequency selectivity and reliability. And the near-zero resonant frequency temperature coefficient (τf) can guarantee the stability of the device operating at different temperatures. The low sintering temperature (≤950 ℃) enables co-firing with metals with low melting points and high conductivity. Therefore, low dielectric LTCC ceramics have become a current research hotspot, greatly promoting the application of microwave dielectric materials. Microwave dielectric materials can be divided into ceramic systems (tellurite, vanadate, molybdate, tungstate, borate and phosphate, etc.), glass-ceramics (CaO-B2O3-SiO2,MgO-B2O3-SiO2,ZnO-B2O3,MgO-Al2O3-SiO2,Li2O-MgO-ZnO-B2O3-SiO2,CuO-B2O3-Li2O, etc.), and glass+ceramic composite systems. The ceramic system is generally prepared in a stoichiometric ratio by a solid phase method. Glass-ceramics is a polycrystalline material with adjustable composition and excellent microwave dielectric properties, which has been widely used. The high-density glass-ceramic composite system is prepared by adding a ceramic filler into a low softening point glass matrix, and the selection of the ceramic filler material depends on the dielectric requirement of the microelectronic device and is mainly used for improving the dielectric, thermal and mechanical properties. The research and development of high-performance LTCC materials need the matching co-firing of low-temperature sintered dielectric material and inner electrode material, improving the microwave performance of the low-temperature sintered dielectric material and optimizing the thermal expansion coefficient and thermal conductivity of the low-temperature sintered dielectric material. In addition, it is also considered that the low-temperature sintered dielectric material has good mechanical strength and low production cost. This work summarizes the concept and classification of low temperature co-fired materials with low dielectric permittivity and focuses on the research status and performance characteristics of various types of LTCC ceramics, glass ceramics and glass+ceramic composite systems. In addition, the main problems faced in the preparation and application of low-temperature and low dielectric co-fired materials are analyzed, and the application prospect in future communication technology is discussed, which can provide a reference for the future development of low firing high-performance microwave dielectric materials.
|
Published: 25 October 2023
Online: 2023-10-19
|
|
Fund:National Natural Science Foundation of China (61865003). |
|
|
1 Sebastian M T, Ubic R, Jantunen H. International Materials Reviews, 2015, 60(7), 392. 2 Park J H, Choi Y J, Park J H, et al. Materials Chemistry and Physics, 2004, 88(2-3), 308. 3 Sebastian M T, Wang H, Jantunen H. Current Opinion in Solid State and Materials Science, 2016, 20(3), 151. 4 Kim E S, Kim S H. Journal of Electroceramics, 2006, 17(2-4), 471. 5 Wang Y Y. Research on microwave properties of the(Zn1-xMgx)2SiO4-based ceramic sintered at low temperature. Master’s Thesis, Nanjing University of Aeronautics and Astronautics, China, 2012(in Chinese). 王莹莹. 低温烧结(Zn1-xMgx)2SiO4基陶瓷的微波介电性能研究. 硕士学位论文, 南京航空航天大学, 2012. 6 Dong X, Sun C L, Yang H Y, et al. Journal of Materials Science: Materials in Electronics, 2018, 29(20), 17967. 7 Konishi Y. Proceedings of the IEEE, 1991, 79(6), 726. 8 Jiang D H, Chen J J, Lu B B, et al. Ceramics International, 2019, 45(7), 8233. 9 Kajfez D. Journal of the European Ceramic Society, 2001, 21(15), 2663. 10 Bosman A J, Havinga E E. Physical Review, 1963, 129(4), 1593. 11 Park H S, Yoon K H, Kim E S. Journal of the American Ceramic Society, 2001, 84(1), 99. 12 Hu M, Gu H, Chu X, et al. Journal of Applied Physics, 2008, 104(12), 124104. 13 Harrop P J. Journal of Materials Science, 1969, 4(4), 370. 14 Ohsato H, Tsunooka T, Kan A, et al. Key Engineering Materials, 2004, 269, 195. 15 Sebastian M T, Ubic R, Jantunen H. International Materials Reviews, 2015, 60(7), 392. 16 Guo J, Zhou D, Wang L, et al. Dalton Transactions, The Royal Society of Chemistry, 2013, 42(5), 1483. 17 Wang S F, Huang C Y, Liu Y L. Journal of the American Ceramic Society, 2010, 93(10), 3272. 18 Hu M Z, Fu Y, Luo C Y, et al. Journal of the American Ceramic Society, 2010, 93(10), 3354. 19 Surendran K P, Santha N, Mohanan P, et al. The European Physical Journal B, 2004, 41(3), 301. 20 George S, Sebastian M T, Raman S, et al. International Journal of Applied Ceramic Technology, 2011, 8(1), 172. 21 Xu J F, Chen Z N, Qing X M, et al. IEEE Transactions on Antennas and Propagation, 2011, 59(3), 826. 22 Ciosek P, Zawadzki K, Stadnik D, et al. Journal of Solid State Electrochemistry, 2009, 13(1), 129. 23 Zhang Y G, Wu X G. Advanced Materials Research, 2014, 906, 25. 24 Sasikala T S, Suma M N, Mohanan P, et al. Journal of Alloys and Compounds, 2008, 461(1-2), 555. 25 Kwon D K, Lanagan M T, Shrout T R. Materials Letters, 2007, 61(8-9), 1827. 26 Kim H T, Nahm S, Byun J D, et al. Journal of the American Ceramic Society, 2004, 82(12), 3476. 27 Hong T. Study on the synthesis and low temperature sintering characteristics of CaMoO4 Ceramics. Master’s Thesis, University of Electronic Science and Technology, China, 2019(in Chinese). 洪涛. CaMoO4陶瓷的合成及低温烧结特性研究. 硕士学位论文, 电子科技大学, 2019. 28 Guo H Z, Baker A, Guo J, et al. ACS Nano, 2016, 10(11), 10606. 29 Guo H Z, Guo J, Baker A, et al. ACS Applied Materials & Interfaces, 2016, 8(32), 20909. 30 Wang H, Du H L, Peng Z, et al. Ceramics International, 2004, 30(7), 1225. 31 Wang H, Peng Z, Du H L, et al. Ceramics International, 2004, 30(7), 1219. 32 Kjeldsen J, Rodrigues A C M, Mossin S, et al. The Journal of Physical Chemistry B, 2014, 118(51), 14942. 33 Wang Y, Zuo R Z, Chen Z, et al. Journal of the American Ceramic Society, 2015, 98(1), 1. 34 Li W, Fang L, Sun Y H, et al. Journal of Electronic Materials, 2017, 46(4), 1956. 35 Li W B, Xi H H, Zhou D. Ceramics International, 2015, 41(7), 9063. 36 Ding K F. Preparation of LiMVO4(M=Mg, Zn) materials. Master’s Thesis, Dalian University of Technology, China, 2018(in Chinese). 丁凯峰. LiMVO4(M=Mg, Zn)材料的制备. 硕士学位论文, 大连理工大学, 2018. 37 Joung M R, Kim J S, Song M E, et al. Journal of the American Ceramic Society, 2009, 92(7), 1621. 38 Joung M R, Kim J S, Song M E, et al. Journal of the American Ceramic Society, 2009, 92(12), 3092. 39 Joung M R, Kim J S, Song M E, et al. Journal of the American Ceramic Society, 2009, 92(9), 2151. 40 Fang L, Wei Z H, Su C X, et al. Ceramics International, 2014, 40(10, Part B), 16835. 41 Naveenraj R, Suresh E K, Johnson D, et al. European Journal of Inorganic Chemistry, 2019, 7. 42 Zhou Z Z, Zhang D, Xu J M, et al. Journal of Materials Engineering, 2009(11), 20(in Chinese). 周振泽, 张德, 徐建梅, 等. 材料工程, 2009(11), 20. 43 Umemura R, Ogawa H, Ohsato H, et al. Journal of the European Ceramic Society, 2005, 25(12), 2865. 44 Wang Y, Zuo R Z. Journal of the European Ceramic Society, 2016, 36(1), 247. 45 Huang C L, Chu T M, Tsai M H. Materials Science and Engineering: B, 2021, 268, 115114. 46 Umemura R, Ogawa H, Yokoi A, et al. Journal of Alloys and Compounds, 2006, 424(1), 388. 47 Umemura R, Ogawa H, Kan A. Journal of the European Ceramic Society, 2006, 26(10-11), 2063. 48 Dong J W, Xu J M, Zhang D, et al. Journal of the Chinese Ceramic Society, 2010, 38(3), 381(in Chinese). 董金文, 徐建梅, 张德, 等. 硅酸盐学报, 2010, 38(3), 381. 49 Ogawa H, Yokoi A, Umemura R, et al. Journal of the European Ceramic Society, 2007, 27(8), 3099. 50 Fang L, Su C X, Zhou H F, et al. Journal of the American Ceramic Society, 2013, 96(3), 688. 51 Su C X, Fang L, Wei Z H, et al. Ceramics International, 2014, 40(3), 5015. 52 Luo H, Fang W S, Fang L, et al. Ceramics International, 2016, 42(8), 10506. 53 Zhou H, Sun W, Liu X, et al. Ceramics International, 2019, 45(2, Part A), 2629. 54 Chen J Q, Tang Y, Xiang H C, et al. Journal of the European Ceramic Society, 2018, 38(14), 4670. 55 Xiang H C, Fang L, Jiang X W, et al. P. K. Davies. Journal of the American Ceramic Society, 2016, 99(2), 399. 56 Tang Y, Jiang X W, Xiang H C, et al. Ceramics International, 2017, 43(2), 2892. 57 Xiang H C, Fang L, Jiang X W, et al. Ceramics International, 2016, 42(2, Part B), 3701. 58 Xu M Y, Xiang H C, Fang L, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(16), 12342. 59 Yao G G, Liu P, Zhang H W. Journal of the American Ceramic Society, 2013, 96(6), 1691. 60 Yao G G, Liu P, Zhao X G, et al. Journal of the European Ceramic Society, 2014, 34(12), 2983. 61 Wang D, Xiang H C, Tang Y, et al. Ceramics International, 2016, 42(13), 15094. 62 Chen J Q, Li C C, Xiang H C, et al. Materials Research Bulletin, 2018, 100, 377. 63 Neelakantan U A, Kalathil S E, Ratheesh R. European Journal of Inorganic Chemistry, 2015, 2015(2), 305. 64 Yao G G, Ren Z Y, Liu P. Journal of Electroceramics, 2018, 40(2), 144. 65 Huang C L, Chiang P E, Hsu T H. Materials Science and Engineering: B, 2021, 273, 115438. 66 Dong Z W, Zheng Y, Cheng P, et al. Materials Letters, 2014, 131, 151. 67 Unnimaya A N, Suresh E K, Ratheesh R. Materials Research Bulletin, 2017, 88, 174. 68 Kalathil S E, Neelakantan U A, Ratheesh R. N. Alford. Journal of the American Ceramic Society, 2014, 97(5), 1530. 69 Yin C Z, Li C C, Yang G J, et al. Journal of the European Ceramic Society, 2020, 40(2), 386. 70 Yao G G, Li Y, Yan J X, et al. Ceramics International, 2021, 47(12), 17147. 71 Li J, Li C C, Wei Z H, et al. Journal of the American Ceramic Society, 2015, 98(3), 683. 72 Suresh E K, Unnimaya A N, Surjith A, et al. Ceramics International, 2013, 39(4), 3635. 73 Choi G K, Kim J R, Yoon S H, et al. Journal of the European Ceramic Society, 2007, 27(8-9), 3063. 74 Yoon S H, Kim D W, Cho S Y, et al. Journal of the European Ceramic Society, 2006, 26(10-11), 2051. 75 Guo J, Zhou D, Wang H, et al. Journal of Alloys and Compounds, 2011, 509(19), 5863. 76 Zhu H K, Dong Y, Gu H D, et al. Ceramics International, 2020, 46(10), 16119. 77 Joseph N, Varghese J, Teirikangas M, et al. Composites Part B: Engineering, 2018, 141, 214. 78 Zhang Q, Su H, Huang F Y, et al. Journal of the European Ceramic Society, 2021, 41(13), 6502. 79 Zhang Q, Xu L L, Tang X L, et al. Journal of Alloys and Compounds, 2021, 874, 159928. 80 Zhang Q, Su H, Zhang H W, et al. Journal of Materiomics, 2022, 8(2), 392. 81 Zhang Z, Su H, Tang X L, et al. Ceramics International, 2014, 40(1), 1613. 82 Zhou D, Randall C A, Wang H, et al. Journal of the American Ceramic Society, 2010, 93(4), 1096. 83 Zhou D, Randall C A, Pang L X, et al. Journal of the American Ceramic Society, 2011, 94(2), 348. 84 Xiao K, Li C C, Xiang H C, et al. Journal of Materials Science: Materials in Electronics, 2018, 29(8), 6397. 85 Zhou D, Randall C A, Pang L X, et al. Journal of the American Ceramic Society, 2011, 94(3), 802. 86 Bian W J, Zhou G H, Dong Y, et al. Ceramics International, 2021, 47(5), 7081. 87 Lyu X Y, Li Z X, Jin J J, et al. Ceramics International, 2022, 48(12), 17225. 88 Zhou H F, Gong J Z, Xu J G, et al. Journal of Materials Science: Materials in Electronics, 2016, 27(6), 6389. 89 Tseng C F, Hsu H C, Chen P H. Journal of Alloys and Compounds, 2018, 764, 840. 90 Zhou D, Pang L X, Wang D W, et al. Journal of the European Ceramic Society, 2019, 39(7), 2374. 91 Liu W Q, Zuo R Z. Journal of the European Ceramic Society, 2018, 38(1), 339. 92 Xing C F, Wu B, Bao J, et al. Ceramics International, 2019, 45(17), 22207. 93 Tao B J, Xing C F, Wang W F, et al. Ceramics International, 2019, 45(18), 24675. 94 Zheng J J, Xing C F, Yang Y K, et al. Journal of Alloys and Compounds, 2020, 826, 153893. 95 Yuan X F, Xue X, Jin F, et al. Journal of the European Ceramic Society, 2019, 39(14), 4156. 96 Zhou H F, Tan X H, Huang J, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(15), 11439. 97 Zhang G, Guo J, He L, et al. Journal of the American Ceramic Society, 2014, 97(1), 241. 98 Zhang G Q, Wang H, Guo J, et al. Journal of the American Ceramic Society, 2015, 98(2), 528. 99 Yuan X F, Zhang G Q, Wang H. Journal of the European Ceramic Society, 2018, 38(15), 4967. 100 Huang C L, Huang J L, Hsu T H. Materials Research Bulletin, 2021, 141, 111355. 101 Ma X M, Du J L, Lu S, et al. Journal of Alloys and Compounds, 2021, 888, 161540. 102 Došler U, Kržmanc M M, Suvorov D. Journal of the European Ceramic Society, 2010, 30(2), 413. 103 Wu X G, Wang H, Chen Y H, et al. D. Suvorov. Journal of the American Ceramic Society, 2012, 95(6), 1793. 104 Liu Y P, Wang Y N, Li Y M, et al. Ceramics International, 2016, 42(5), 6475. 105 Pang L X, Zhou D, Li W B, et al. Journal of the European Ceramic Society, 2017, 37(9), 3073. 106 Ding G A, Liu F, Qu J J, et al. Ceramics International, 2021, 47(18), 26400. 107 Chang S Y, Pai H F, Tseng C F, et al. Journal of Alloys and Compounds, 2017, 698, 814. 108 Zhou D, Pang L X, Wang D W, et al. ACS Sustainable Chemistry & Engineering, 2018, 6(8), 11138. 109 Zhong M F, Tang X L, Li Y X, et al. Ceramics International, 2020, 46(11), 18667. 110 Yang H M, Zheng Y, Lu X P, et al. Ceramics International, 2021, 47(21), 30980. 111 Gu Y J, Lei L W, Huang J L, et al. Journal of the European Ceramic Society, 2019, 39(4), 1137. 112 Yang H C, Zhang S R, Wen Q Y, et al. Journal of the European Ceramic Society, 2021, 41(4), 2596. 113 Wang K G, Yin T T, Zhou H F, et al. Journal of the European Ceramic Society, 2020, 40(2), 381. 114 Zhou H F, Tan X H, Liu X B, et al. Journal of Materials Science: Materials in Electronics, 2018, 29(21), 18486. 115 Ohashi M, Ogawa H, Kan A, et al. Journal of the European Ceramic Society, 2005, 25(12), 2877. 116 Bao J, Du J L, Liu L T, et al. Ceramics International, 2022, 48(1), 784. 117 Thomas D, Sebastian M T. Journal of the American Ceramic Society, 2010, 93(11), 3828. 118 Shi F, Xiao E C. Materials Chemistry and Physics, 2021, 259, 124139. 119 Thomas D, Sebastian M T. Journal of the European Ceramic Society, 2012, 32(10), 2359. 120 Dong Z W, Zheng Y, Cheng P, et al. Ceramics International, 2014, 40(8, Part B), 12983. 121 Dong Z W, Zheng Y, Cheng P, et al. Ceramics International, 2014, 40(9), 14865. 122 Zhang P, Sun K X, Wu S X, et al. Materials Letters, 2019, 255, 126565. 123 Peng R, Li Y X, Yu G L, et al. Journal of Electronic Materials, 2018, 47(12), 7281. 124 Peng R, Lu Y C, Tao Z H, et al. Ceramics International, 2020, 46(8, Part A), 11021. 125 Peng R, Li Y X, Su H, et al. Journal of Materials Research and Technology, 2020, 9(3), 4994. 126 Bian J, Kim D W, Hong K S. Materials Research Bulletin, 2005, 40(12), 2120. 127 Xia C C, Chen G H, Yuan C L, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(18), 13970. 128 Xia C C, Jiang D H, Chen G H, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(16), 12026. 129 Zhang P, Wu S X, Xiao M. Journal of the European Ceramic Society, 2018, 38(13), 4433. 130 Park I H, Kim B S, Kim K Y, et al. Japanese Journal of Applied Physics, 2001, 40(Part 1, No. 8), 4956. 131 Ohsato H, Tsunooka T, Sugiyama T, et al. Journal of Electroceramics, 2006, 17(2), 445. 132 Tsunooka T, Androu M, Higashida Y, et al. Journal of the European Ceramic Society, 2003, 23(14), 2573. 133 Song M E, Kim J S, Joung M R, et al. Journal of the American Ceramic Society, 2008, 91(8), 2747. 134 Sugiyama T, Tsunooka T, Kakimoto K, et al. Journal of the European Ceramic Society, 2006, 26(10-11), 2097. 135 Li J, Su H K, Sun Y H, et al. Ceramics International, 2021, 47(11), 15039. 136 Lai Y M, Hong C Y, Jin L C, et al. Ceramics International, 2017, 43(18), 16167. 137 Guo Y P, Ohsato H, Kakimoto K. Journal of the European Ceramic Society, 2006, 26(10-11), 1827. 138 Nguyen N H, Lim J B, Nahm S, et al. Journal of the American Ceramic Society, 2007, 90(10), 3127. 139 Kim J S, Nguyen N H, Lim J B, et al. Journal of the American Ceramic Society, 2008, 91(2), 671. 140 Kim J S, Song M E, Joung M R, et al. Journal of the American Ceramic Society, 2008, 91(12), 4133. 141 Zhong M F, Su H, Jing X L, et al. Ceramics International, 2020, 46(9), 13095. 142 Joseph T, Sebastian M T, Jantunen H, et al. International Journal of Applied Ceramic Technology, 2011, 8(4), 854. 143 Zhang Q L, Yang H, Sun H P. Journal of the European Ceramic Society, 2008, 28(3), 605. 144 Li L, Hong W B, Chen G Y, et al. Journal of Alloys and Compounds, 2019, 774, 706. 145 Yokoi A, Ogawa H, Kan A, et al. Journal of the European Ceramic Society, 2005, 25(12), 2871. 146 Yao G G, Liu P. Physica B: Condensed Matter, 2010, 405(2), 547. 147 Chen K, Zheng Y, Dong Z W, et al. Materials Reports, 2017, 31(S2), 115(in Chinese). 陈康, 郑勇, 董作为, 等. 材料导报, 2017, 31(S2), 115. 148 Kim D W, Ko K H, Hong K S. Journal of the American Ceramic Society, 2001, 84(6), 1286. 149 Pullar R C, Lai C, Azough F, et al. Journal of the European Ceramic Society, 2006, 26(10), 1943. 150 Zhou D, Wang H, Pang L X, et al. Journal of the American Ceramic Society, 2008, 91(12), 4115. 151 Bian J J, Wu J Y, Wang L. Journal of the European Ceramic Society, 2012, 32(6), 1251. 152 Zhou H, Wang W, Chen X, et al. Ceramics International, 2014, 40(1, Part B), 2103. 153 Gu F F, Chen G H, Li X Q, et al. Materials Chemistry and Physics, 2015, 167, 354. 154 Chu X, Jiang J, Wang J Z, et al. Ceramics International, 2021, 47(3), 4344. 155 Kan A, Ogawa H, Yokoi A, et al. Journal of the European Ceramic Society, 2007, 27(8), 2977. 156 Su W A, Liu P, Bian X B. Electronic Components and Materials, 2005(8), 11(in Chinese). 苏未安, 刘鹏, 边小兵. 电子元件与材料, 2005(8), 11. 157 Wu Y, Su L N, Liang H R, et al. Journal of Shaanxi Normal University(Natural Science Edition), 2011, 39(3), 41(in Chinese). 吴怡, 苏丽娜, 梁海荣, 等. 陕西师范大学学报(自然科学版), 2011, 39(3), 41. 158 Yao G G. Low temperature sintering of low dielectric constant microwave dielectric ceramics. Ph.D. Thesis, Shaanxi Normal University, China, 2013(in Chinese). 姚国光. 低温烧结低介电常数微波介质陶瓷研究. 博士学位论文, 陕西师范大学, 2013. 159 Zhang C, Chen Y, Li X, et al. Journal of Materiomics, 2021, 7(3), 478. 160 Kan A, Ogawa H, Moriyama T. Journal of Materials Research, 2012, 27(6), 915. 161 Lu N, He G, Yang Z C, et al. Scripta Materialia, 2020, 174, 91. 162 Weng Z Z, Han Z Y, Xiao F, et al. Ceramics International, 2018, 44(12), 14145. 163 Hong T, Hu Y D, Bao S X, et al. Journal of Electronic Materials, 2019, 48(2), 972. 164 Xi J, Shang F, Liu F, et al. Ceramics International, 2020, 46(11), 19650. 165 Zhan Y, Li L X, Du M K. Ceramics International, 2021, 47(19), 27462. 166 Deng Y, Yao P, Li B. Materials Letters, 2021, 285, 129125. 167 Zuo H Z, Tang X L, Zhang H W, et al. Ceramics International, 2017, 43(12), 8951. 168 Zhou Z H, Su H, Tang X L, et al. Ceramics International, 2016, 42(9), 11161. 169 Wang M X, Zhong C W, Qin T Y, et al. Ceramics International, 2020, 46(8), 12088. 170 Du X, Su H, Zhang H, et al. Ceramics International, 2017, 43(10), 7636. 171 Dou G, Guo M, Li Y X, et al. Journal of Materials Science: Materials in Electronics, 2015, 26(6), 4207. 172 Zhang S, Su H, Zhang H W, et al. Ceramics International, 2016, 42(14), 15242. 173 Lan X K, Zou Z Y, Lu W Z, et al. Ceramics International, 2016, 42(15), 17731. 174 Liu C, Zhang H W, Wang G, et al. Materials Research Bulletin, 2017, 93, 16. 175 Varghese J, Gopinath S, Sebastian M T. Materials Chemistry and Physics, 2013, 137(3), 811. 176 Zhang P, Liu L, Zhao Y G, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(8), 5802. 177 Zhang P, Xie H, Zhao Y G, et al. Journal of Alloys and Compounds, 2017, 690, 688. 178 Wang Y, Zuo R Z, Zhang J, et al. Journal of Materials Science: Materials in Electronics, 2015, 26(7), 4963. 179 Wang H Y, Su H, Lai Y M, et al. Journal of Materials Science: Materials in Electronics, 2017, 28(19), 14190. 180 Tummala R R. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992, 15(4), 6. 181 Qing Z J, Li B, Li H, et al. Journal of Materials Science: Materials in Electronics, 2014, 25(5), 2149. 182 Li B, Wang S L, Fang Y. Journal of Alloys and Compounds, 2017, 693, 9. 183 Xia G B, He L T, Yang D. Journal of Alloys and Compounds, 2012, 531, 70. 184 Ren H S. Study on B2O3-La2O3-MgO-TiO2 Glass-ceramics Based LTCC Materials. Ph. D. Thesis, University of Chinese Academy of Sciences(Shanghai Institute of Ceramics Chinese Academy of Sciences), China, 2018(in Chinese). 任海深. B2O3-La2O3-MgO-TiO2微晶玻璃基低温共烧陶瓷研究. 博士学位论文, 中国科学院大学(中国科学院上海硅酸盐研究所), 2018. 185 Chang C R, Jean J H. Journal of the American Ceramic Society, 1999, 82(7), 1725. 186 Wang S F, Wang Y R, Hsu Y F, et al. Journal of Alloys and Compounds, 2010, 498(2), 211. 187 Wei P F, Yang X L, Hao L Y, et al. Electronic Components and Materials, 2013, 32(4), 6(in Chinese). 韦鹏飞, 杨晓莉, 郝凌云, 等. 电子元件与材料, 2013, 32(4), 6. 188 He D F, Gao C. Ceramics International, 2018, 44(14), 16246. 189 Zhu H Y, Fu R L, Agathopoulos S, et al. Ceramics International, 2018, 44(9), 10147. 190 Došler U, Kržmanc M M, Suvorov D. Ceramics International, 2012, 38(2), 1019. 191 Yu H T, Ju K, Wang K M. Journal of the American Ceramic Society, 2014, 97(3), 704. 192 Yu H T, Liu J S, Zeng M S, et al. Journal of Materials Science: Materials in Electronics, 2016, 27(7), 7109. 193 Xie L S, Zhong C W, Fang Z X, et al. Journal of the Ceramic Society of Japan, 2018, 126(3), 163. 194 Chen G H, Liu X Y. Journal of Alloys and Compounds, 2007, 431(1-2), 282. 195 Ma M S, Fu Z Q, Liu Z F, et al. Ceramics International, 2017, 43, S292. 196 Xi J, Lu B B, Chen J J, et al. Journal of Non-Crystalline Solids, 2019, 521, 119527. 197 Jiang D H, Chen J J, Lu B B, et al. Journal of Materials Science: Materials in Electronics, 2018, 29(21), 18426. 198 Lu B B, Huang J, Jiang D H, et al. Journal of Materials Science: Materials in Electronics, 2019, 30(20), 18599. 199 Zitani M K, Ebadzadeh T, Banijamali S, et al. Journal of Non-Crystalline Solids, 2018, 487, 65. 200 Chen G Y, Ma M S, Wei A Q, et al. Ceramics International, 2019, 45(16), 19689. 201 Imanaka Y, Yamazaki K, Aoki S, et al. Journal of the Ceramic Society of Japan, 2010, 97(1123), 309. 202 Wang H J, Bocker C, Li B T, et al. Solid State Sciences, 2017, 70, 6. 203 He D F, Zhong H, Gao C. Journal of Alloys and Compounds, 2019, 799, 50. 204 Han J, Xiang Y, Yao Z Q, et al. Journal of Materials Science: Materials in Electronics, 2019, 30(6), 5902. 205 Hsiang H I, Mei L T, Yang S W, et al. Ceramics International, 2011, 37(7), 2453. 206 Hsiang H I, Yung S W, Wang C C. Ceramics International, 2014, 40(10), 15807. 207 Induja I J, Sebastian M T. Journal of the American Ceramic Society, 2017, 100(6), 2632. 208 Luo X F, Ren L C, Xia Y S, et al. Ceramics International, 2017, 43(9), 6791. 209 Ren L, Zhang M, Zhou H. Ceramics International, 2020, 46(16), 25979. 210 Xi J, Chen G H, Liu F, et al. Ceramics International, 2019, 45(18), 24431. 211 Shang Y, Zhong C W, Xiong H J, et al. Ceramics International, 2019, 45(11), 13711. 212 Qin T Y, Zhong C W, Tang B, et al. Journal of the European Ceramic Society, 2021, 41(2), 1342. 213 Xiang L T, Zhong C W, Qin T Y, et al. Ceramics International, 2021, 47(20), 28904. 214 Wang F, Lou Y H, Li Z J, et al. Ceramics International, 2021, 47(7), 9955. 215 Chen X Y, Wang F L, Zhang W J. Journal of Materials Science: Materials in Electronics, 2019, 30(3), 3098. 216 Hsiang H I, Yung S W, Wang C C. Materials Research Bulletin, 2014, 60, 730. 217 Li B, Long Q Y, Duan D N. Journal of Materials Science: Materials in Electronics, 2016, 27(3), 2824. 218 Liu J Z, Yao Z H, Xu N X, et al. Key Engineering Materials, 2016, 697, 253. 219 Ren H S, Dang M Z, Wang H J, et al. Materials Letters, 2018, 210, 113. 220 Ju K, Yu H T, Ye L, et al. Journal of the American Ceramic Society, 2013, 96(11), 3563. 221 Li B, Li W, Zheng J G. Journal of Alloys and Compounds, 2017, 725, 1091. 222 Li B, Duan D N, Long Q Y. Journal of Materials Science: Materials in Electronics, 2016, 27(7), 7240. 223 Wang F L, Zhang W J, Chen X Y, et al. Ceramics International, 2019, 45(6), 7203. 224 Ebrahimi F, Nemati A, Banijamali S. Journal of Alloys and Compounds, 2021, 882, 160722. 225 Li B, Tang B, Xu M J. Journal of Electronic Materials, 2015, 44(10), 3849. 226 Li B, Bian H B, Jing K. Materials Letters, 2019, 234, 302. 227 Keshavarz M, Ebadzadeh T, Banijamali S. Ceramics International, 2017, 43(12), 9259. 228 Wang F L, Zhang W J, Chen X Y, et al. Journal of the European Ceramic Society, 2020, 40(6), 2382. 229 Lv Y Y, Zhang L, Yang S Q, et al. Ceramics International, 2021, 47(9), 13035. |
|
|
|