氮化硼/聚合物导热复合材料界面热阻调控研究进展

doi:10.11896/cldb.21080118

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Abstract With the development of 5G communication, thermal management has become an increasingly severe problem in electronic devices. Boron nitride (BN) is a category of high-thermal-conductivity (TC) and highly insulating thermally conductive fillers widely used in thermal management, including hexagonal boron nitride (h-BN), boron nitride nanosheets (BNNSs), and boron nitride nanotubes (BNNTs). However, the BN surface is chemically inert, and its low affinity and phonon-spectrum mismatch with the matrix or other fillers lead to significant interfacial thermal resistance (ITR) between the filler and matrix/filler, which limits the enhancement of TC of the composites and makes it difficult to meet usage requirements. Therefore, how to regulate the ITR, design the thermal conductivity interface of BN/polymer thermally conductive composites, and improve the thermal conductivity of the composites is a current challenge.
Researchers have explored the differences and causes of heat-flow conduction at the interface from two separate perspectives: theoretical simulation and experimental verification. In theoretical studies, molecular dynamics (MD) simulations and finite element analysis (FEA) methods combined with models such as effective medium model and its optimization model, Foygel model, are used for in-depth theoretical simulation and analysis of ITR. Among these, the key parameters affecting ITR include BN content, size and crystal state, and BN distribution morphology, among others. In experimental design, to improve the ITR between the filler and substrate, the BN surface is first modified by covalent bonding or surface coating, and then the corresponding functional groups are designed to improve the interfacial force with the polymer in combination with the polymer species. Among these, the covalent bonding modification of the BN surface causes some damage to the BN crystal structure itself, while surface coating can better maintain the BN structure. To improve the ITR between fillers, researchers often use strategies such as BN orientation arrangement, bridging, and construction of three-dimensional (3D) thermal network structure to improve the contact between fillers. The bridging method is used to connect the separated BN to each other to build better thermal conductivity paths by forming heterogeneous structures in the matrix. Methods of building 3D thermal network structures that can create long-range continuous thermal conductivity paths have been widely developed in recent years and include the ice template method, salt templates, the foaming strategy, building a gel network, and two-phase/three-phase isolated structure.
The current level of research progress is summarized in this review. First, we summarize the models used to calculate the thermal resistance of the BN/polymer interface and the progress of related simulations, and summarize the strategies for optimizing ITR of polymer/BN thermally conductive composites from two separate perspectives, i.e., those of ITR between the filler and matrix/filler. In addition, we compare the effect of various methods on improving the TC of composites and look forward to the development trend of low-ITR and high-TC composites.

Key words： thermally conductive composites boron nitride (BN) polymer interfacial thermal resistance between filler and matrix (ITR_F-M) interfacial thermal resistance between filler and filler (ITR_F-F)

Published: 25 September 2023 Online: 2023-09-18

CLC number:

TB332

Fund:National Natural Science Foundation of China (51503061), Natural Science Foundation of Hubei Province of China (2015CFB322, 2015BAA094), and Special Project of Knowledge Innovation in Wuhan (2022010801020261).

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	ZHANG Rong
	LIU Zhuohang
	XIONG Wenwei
	LIN Qianhui
	HE Xuehang
	LI Siqi
	LIU Qingting
	FU Xudong
	HU Shengfei

Cite this article:

ZHANG Rong,LIU Zhuohang,XIONG Wenwei, et al. Recent Progress of Interface Thermal Resistance Regulation of Thermally Conductive Composites Based on Boron Nitride/Polymer[J]. Materials Reports, 2023, 37(18): 21080118-13.

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http://www.mater-rep.com/EN/10.11896/cldb.21080118 OR http://www.mater-rep.com/EN/Y2023/V37/I18/21080118

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