泡沫Ni/In-48Sn复合焊料钎焊Al合金接头显微结构及力学性能研究

doi:10.11896/cldb.22100141

Abstract
Figure/Table
References
Related Citation (15)

Download:

Full Text ( PDF ) (16064KB)
Export: BibTeX | EndNote (RIS)

Abstract In-48Sn eutectic solder has the advantages of low melting point, high ductility, and good wettability, and is widely used in the soldering of microwave, communication, and other functional components. However, the mechanical properties of In-48Sn eutectic solder are poor, which made it difficult to meet the load requirements of the latest functional components. By adding trace alloys, nano-sized particles or fibers into In-Sn solders could improve the strength of them to a certain extent, but the strength improvements of joints using these solders were limited. Based on these, we prepared Ni foam strengthened In-48Sn composite solders by vacuum infiltration process, then using the as-fabricated composite sol-ders to join Ag coated Al alloy at low temperature. Effects of Ni foam porosity and soldering time on the microstructure and mechanical properties of the joints were studied. Results showed that the Ag₂In intermetallic compound (IMC) layer formed on the Al alloy surface, the thickness of which increased with prolonging soldering time; moreover, the Ag₂In phase tended to form a block structure in the solder seam when there were no Ni skeleton barriers. A (Ni, Cu)₃(In, Sn)₇ phase formed during the reaction between In-48Sn solder and Ni skeletons. Prolonging the soldering time and reducing the porosity of Ni foams could both promote the formation of reaction phases and accelerate the consumption of In-48Sn solder, accompanied by the shear strength improvements of the joints. Finally, the soldering seam was completely composed of Ni skeleton and IMCs. The joint soldered with 50%Ni-In48Sn composite solder for 120 min obtained a shear strength of 34.34 MPa, which was 335.2% higher than that soldered with In-48Sn eutectic solder.

Key words： Ni foam In-48Sn solder Al alloy joint microstructure mechanical property

Published: 10 September 2023 Online: 2023-09-05

CLC number:

TG425

Fund:JCJQ Program (2020-JCJQ-JJ-088) and Equipment Pre-research Field Foundation (80922020602).

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	CHEN Gaiqing
	LIU Kai
	XU Xing
	WU Ying
	XIAO Yong

Cite this article:

CHEN Gaiqing,LIU Kai,XU Xing, et al. Microstructure and Mechanical Properties of Al Alloy Joint Soldered with Ni Foam/In-48Sn Composite Solder[J]. Materials Reports, 2023, 37(17): 22100141-6.

URL:

http://www.mater-rep.com/EN/10.11896/cldb.22100141 OR http://www.mater-rep.com/EN/Y2023/V37/I17/22100141

1 Zhou J H, Dong Y Z. Automobile Applied Technology, 2019(7), 200 (in Chinese).
周精浩, 董焱章. 汽车实用技术, 2019(7), 200.
2 Sommadossi S, Litynska L, Zieba P, et al. Materials Chemistry and Physics, 2003, 81(2-3), 566.
3 Lin S K, Chang R B, Chen S W, et al. Materials Chemistry and Physics, 2015, 154, 60.
4 Wu Y, Zhong J F, Zhang D M. Electro-Mechanical Engineering, 2005, 21(1), 44 (in Chinese).
吴迤, 钟剑锋, 张德明. 电子机械工程, 2005, 21(1), 44.
5 Le H, Shen Y, Jin S, et al. Journal of Materials Science, 2020, 55(24), 10824.
6 Yang L, Yang Y, Zhang Y C, et al. Applied Physics A-Materials Science & Processing, 2020, 126(5), 1.
7 Wang J, Mao D, Shi L, et al. Journal of Electronic Materials, 2019, 48(2), 817.
8 LuoX, Peng J C, Zanden C, et al. Acta Materialia, 2016, 104, 109.
9 Chang S Y, Jain C, Chuang T, et al. Materials & Design, 2011, 32(10), 4720.
10 Basista M, Jakubowska J, Glewski W W. Advanced Engineering Materials, 2017, 19(12), 14.
11 Chang H, Higginson R, Binner J. Journal of Materials Science, 2010, 45(3), 662.
12 Zhao L Z, Zhao M J, Na L, et al. Transactions of Nonferrous Metals So-ciety of China, 2010, 20, s463.
13 Zaharinie T, Moshwan R, Yusof F, et al. Materials & Design, 2014, 54, 375.
14 Ho C E, Lu M K, Lee P T, et al. Materials Science and Engineering:A, 2017, 706, 269.
15 Kai L, Jiaqi L, Jian Z, et al. The Journal of Materials Science:Materials in Electronics, 2022, 33, 12594.
16 Peng F, Liu W, Ma Y, et al. Soldering & Surface Mount Technology, 2019, 31(1), 1.
17 Jong S K, Pin J W, Chin C L. IEEE Transactions on Components and Packing Technologies, 2008, 31, 4.
18 Edyta Matyja, Krystian Prusik, Maciej Zubko, et al. Journal of Alloys and Compounds, 2019, 801, 529.
19 He S, Huang S, Ye Y, et al. Journal of Alloys and Compounds, 2020, 845, 156240.
20 Ho C E, Tsai R, Lin Y, et al. Journal of Electronic Materials, 2002, 31, 584.