Cu粉预球磨和烧结工艺对Cu/6061Al界面结构的调控

doi:10.11896/cldb.21120190

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Abstract In this work, the Cu/6061Al diffusion pair was successfully prepared by high-energy ball milling and sintering forming process, and the effect of mechanical milling on the growth of the Cu/6061Al intermetallic compound layer at the Cu/6061Al interface during vacuum hot-pressing sintering was studied. The interface structure and products were characterized by XRD, FESEM, and EPMA analysis. The results show that three layers of copper-aluminum intermetallic compounds are observed at the interface, from Cu to the 6061Al side, there are Cu₉Al₄, CuAl, and CuAl₂ phases in sequence. In addition, compared with the non-ball milled samples, many pores were observed in the Cu and Cu₉Al₄ regions of the samples after ball milling, which increased with the increase of the milling time. At the same time, the Cu/Cu₉Al₄ interface also becomes blurred with the increase of ball milling time. For each layered intermetallic compound, the effect of mechanical milling on the growth of the intermetallic compound layer was in descending order:Cu₉Al₄, CuAl, CuAl₂, which was decreasing from the Cu side to the 6061Al side.

Key words： intermetallic phases mechanical milling Cu/6061Al interface layered structure vacuum hot-pressing sintering

Published: 25 July 2023 Online: 2023-07-24

CLC number:

TG111.6

Fund:Program for Innovative Research Team (in Science and Technology) in University of Yunnan Province (14051693), Basic Research Key Project of Yunnan Province (202001AS070049),and Major Science and Technology Special Program of Yunnan Province (202102AB080004).

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	Articles by authors
	WU Shaopeng
	CAI Xiaolan
	ZHOU Lei
	LI Wenhao
	LIU Xusheng
	WANG Yankun

Cite this article:

WU Shaopeng,CAI Xiaolan,ZHOU Lei, et al. Regulation of Cu/6061Al Interfacial Structure by Cu Powder Pre-ball Milling and Sintering Process[J]. Materials Reports, 2023, 37(14): 21120190-6.

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http://www.mater-rep.com/EN/10.11896/cldb.21120190 OR http://www.mater-rep.com/EN/Y2023/V37/I14/21120190

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