光敏聚酰亚胺:低温固化设计策略

doi:10.11896/cldb.21030016

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Abstract Fan-out wafer level packaging (FOWLP) has attracted much attention due to the more optimized solution in cost, size, input/output density, etc. With the thinning of the package thickness, photosensitive polyimide utilized as the dielectric material in redistribution layer needs to fulfill new demanding tasks: lower dielectric constant, lower coefficient of thermal expansion, lower residual stress, lower curing temperature, etc. The main problem faced by FOWLP is wafer warpage. Reducing the thermal budget in packaging process can effectively minimize the stress concentration caused by the difference in thermodynamic properties between the metal and dielectric layers. Therefore, the primary problem to be solved for photosensitive polyimide is avoiding the restriction of curing temperature (>300 ℃) in the conventional system. In this review, the recent research progress and development status in reducing the curing temperature of photosensitive polyimide are summarized from the perspective of polyimide synthesis process. The advantages and disadvantages of low-temperature curing systems based on polyamic acid, polyisoimide and soluble polyimide are introduced. Finally, the further development trend of low-temperature curing system is prospected.

Key words： photosensitive polyimide low-temperature curing design strategy polyamic acid polyisoimide soluble polyimide

Published: 10 October 2022 Online: 2022-10-12

CLC number:

TQ57

Fund:Program for Guangdong Introducing Innovative and Entrepreneurial Team (2016ZT06C412)

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	Articles by authors
	PENG Xiaokang
	HUANG Xingwen
	LIU Rongtao
	ZHANG Yongwen
	ZHANG Shiyang
	HUANG Jintao
	MIN Yonggang

Cite this article:

PENG Xiaokang,HUANG Xingwen,LIU Rongtao, et al. Photosensitive Polyimide: Design Strategy of Low-temperature Curing[J]. Materials Reports, 2022, 36(19): 21030016-9.

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http://www.mater-rep.com/EN/10.11896/cldb.21030016 OR http://www.mater-rep.com/EN/Y2022/V36/I19/21030016

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