POLYMERS AND POLYMER MATRIX COMPOSITES |
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Photosensitive Polyimide: Design Strategy of Low-temperature Curing |
PENG Xiaokang, HUANG Xingwen, LIU Rongtao, ZHANG Yongwen, ZHANG Shiyang, HUANG Jintao, MIN Yonggang
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School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China |
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Abstract Fan-out wafer level packaging (FOWLP) has attracted much attention due to the more optimized solution in cost, size, input/output density, etc. With the thinning of the package thickness, photosensitive polyimide utilized as the dielectric material in redistribution layer needs to fulfill new demanding tasks: lower dielectric constant, lower coefficient of thermal expansion, lower residual stress, lower curing temperature, etc. The main problem faced by FOWLP is wafer warpage. Reducing the thermal budget in packaging process can effectively minimize the stress concentration caused by the difference in thermodynamic properties between the metal and dielectric layers. Therefore, the primary problem to be solved for photosensitive polyimide is avoiding the restriction of curing temperature (>300 ℃) in the conventional system. In this review, the recent research progress and development status in reducing the curing temperature of photosensitive polyimide are summarized from the perspective of polyimide synthesis process. The advantages and disadvantages of low-temperature curing systems based on polyamic acid, polyisoimide and soluble polyimide are introduced. Finally, the further development trend of low-temperature curing system is prospected.
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Published: 10 October 2022
Online: 2022-10-12
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Fund:Program for Guangdong Introducing Innovative and Entrepreneurial Team (2016ZT06C412) |
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1 Dong H, Chen J, Hou D, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(7), 1073. 2 Lau J H. Fan-out wafer-level packaging, Springer, Singapore, 2018. 3 Liang C L, Lin Y S, Kao C L, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(9), 1438. 4 Braun T, Becker K F, Wöhrmann M, et al. In: International Conference on Electronics Packaging. Yamagata, 2017, pp. 325. 5 Shoji Y, Masuda Y, Hashimoto K, et al. In: IEEE 66th Electronic Components and Technology Conference (ECTC). Las Vegas, 2016, pp. 1707. 6 Lau J, Li M, Fan N, et al. International Symposium on Microelectronics, 2017, 2017(1), 000576. 7 Matsukawa D, Nakamura T, Enomoto T, et al. In: Additional Confe-rences (Device Packaging, HiTEC, HiTEN, & CICMT). Phoenix, USA, 2017, pp. 1. 8 Sasaki T. Journal of Photopolymer Science and Technology, 2016, 29, 379. 9 Fu M C, Higashihara T,Ueda M. Polymer Journal, 2017, 50(1), 57. 10 Fukukawa K,Ueda M. Polymer Journal, 2008, 40(4), 281. 11 Tomikawa M, Okuda R,Ohnishi H. Journal of Photopolymer Science and Technology, 2015, 28, 73. 12 Nawrocki D, Cooper A, Koizumi T, et al. International Symposium on Microelectronics, 2018, 2018(1), 000483. 13 Windrich F, Kappert E J, Malanin M, et al. European Polymer Journal, 2016, 84, 279. 14 Wang Y W,Chen W C. Materials Chemistry and Physics, 2011, 126(1-2), 24. 15 Ogura T, Higashihara T,Ueda M. Journal of Polymer Science Part A: Polymer Chemistry, 2010, 48(6), 1317. 16 Tseng L Y, Lin Y C, Kuo C C, et al. Reactive and Functional Polymers, 2020, 157, 104760. 17 Liu J G, Nakamura Y, Ogura T, et al. Chemistry of Materials, 2008, 20(1), 273. 18 Ogura T, Higashihara T,Ueda M. Journal of Polymer Science Part A: Polymer Chemistry, 2009, 47(13), 3362. 19 Mochizuki A, Teranishi T,Ueda M. Macromolecules, 1995, 28, 365. 20 Mochizuki A, Yamada K, Teranishi T, et al. High Performance Polymers, 1994, 6, 225. 21 Mochizuki A, Teranishi T, Ueda M. Polymer, 1995, 36, 2153. 22 Seino H, Haba O, Ueda M, et al. Polymer, 1999, 40, 551. 23 Qian Z G, Ge Z Y, Li Z X, et al. Polymer, 2002, 43, 6057. 24 Li H S, Liu J G, Rui J M, et al. Journal of Polymer Science Part A: Polymer Chemistry, 2006, 44(8), 2665. 25 Liang Z M, Yin J, Wu J H, et al. European Polymer Journal, 2004, 40(2), 307. 26 Zhu Z K, Yin J, Cao F, et al. Advanced Materials, 2000, 12(14), 1055. 27 Saito Y, Mizoguchi K, Higashihara T, et al. Journal of Applied Polymer Science, 2009, 113(6), 3605. 28 Moore J A, Gamble D R. Polymer Engineering and Science, 1992, 32(21), 1642. 29 Shin G J, Jung J C, Chi J H, et al. Journal of Polymer Science Part A: Polymer Chemistry, 2007, 45(5), 776. 30 Choi K H, Jung J C, Kim K S, et al. Polymers for Advanced Technologies, 2005, 16(5), 387. 31 Omote T, Mochizuki H, Koseki K, et al. Macromolecules, 1990, 23, 4796. 32 Omote T, Koseki K,Yamaoka T. Macromolecules, 1990, 23, 4788. 33 Takafumi F, Toshiyuki O, Takao I, et al. Journal of Polymer Science Part A: Polymer Chemistry, 2001, 39, 3451. 34 Sugawara S, Tomoi M, Oyama T. Polymer Journal, 2006, 39(2), 129. |
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