| INORGANIC MATERIALS AND CERAMIC MATRIX COMPOSITES |
|
|
|
|
|
| The Preparation of Ag/Graphene Composite Film for Thermal Conduction and Electromagnetic Interference Shielding |
| LIU Wei1,2, JIA Kun2, GU Jianyu2, MA Chen2, WEI Xuehong1,*
|
1 School of Chemistry and Chemical Engineering, Shanxi University, Taiyuan 030006, China
2 Shanxi Key Laboratory of Electromagnetic Protection Materials and Technology, 33rd Institute of China Electronics Technology Group Corporation, Taiyuan 030032, China |
|
|
|
|
Abstract High thermal conductive materials with excellent electromagnetic interference (EMI) shielding effectiveness (SE) are urgently desirable to eliminate electromagnetic pollution and improve heat-dissipation capacity in electronic devices. Graphene film was prepared by a facile spin-coating method followed by a high-temperature graphitization process. To obtain Ag/graphene composite film (AGCF), Ag nanoparticles were deposited on graphene film using a magnetron sputtering strategy. The structural morphology, thermal/electrical conductivity and EMI shielding performance of the films were characterized and analyzed. The results showed that the graphene film was uniformly decorated by Ag nanoparticles. When the thickness of Ag nano layer reached 200 nm, the square resistance and thermal conductivity of the film were 0.02 Ω/sq and 872 W/(m·K), respectively. Moreover, the EMI SE of AGCF was increased to 37—60 dB in the frequency of 30 MHz—18 GHz compared with bare graphene film. Meanwhile, the SE still remained 85% of initial value after 100 times of bending with a bending angle of 180°, indicating the excellent flexibility of AGCF. These superior properties make AGCF promising for the application in the field of electromagnetic compatibility and heat dissipation in flexible electronic equipment.
|
|
Published: 10 May 2022
Online: 2022-05-09
|
|
|
| Fund:Youth Science Foundation of Shanxi Province (201901D211576) and the National Natural Science Foundation of China (U1710115). |
|
|
1 Hansson J, Nilsson T, Ye L L, et al.International Materials Reviews, 2018, 63(1), 22.
2 Aza M A, Westwood A. Journal of Materials Science, Materials in Electronics, 2019, 30, 10630.
3 Cao M S, Cai Y Z, He P, et al.Chemical Engineering Journal, 2019, 359, 1265.
4 Wang C, Murugadoss V, Kong J, et al.Carbon, 2018, 140, 696.
5 Wan Y J, Zhu P L, Yu S H, et al. Small, 2018, 14, 1800534.
6 Xi J B, Li Y L, Zhou E Z, et al.Carbon, 2018, 135, 44.
7 Wan Y J, Zhu P L, Yu S H, et al.Carbon, 2017, 122, 74.
8 Zhang Z X, Qu J Y, Feng Y Y, et al. Composites Communications, 2018, 9, 33.
9 Peng L, Xu Z, Liu Z, et al.Advanced Materials, 2017, 29, 1700589.
10 Shen B, Zhai W T, Zheng W G.Advanced Functional Materials, 2014, 24(28), 4542.
11 Wang Y X, Huang L J, Tang J G, et al.The Chinese Journal of Nonferrous Metals, 2018, 28(3), 509(in Chinese).
王彦欣, 黄林军, 唐建国, 等. 中国有色金属学报,2018,28(3),509
12 Huang G, Wang H, Cheng P, et al. Microelectronic Engineering, 2016, 157, 7.
13 Hu Z R, Dai R, Wang D N, et al. New Carbon Materials, 2021, 36(2), 420.
14 Gong B L, Kinloch I A, Young R J, et al.Advanced Materials, 2010, 22(24), 2694.
15 Wang L, Qiu H, Liang C B, et al.Carbon, 2019, 141, 506.
16 Wang Z, Mao B Y, Wang Q L, et al.Small, 2018, 14(20), 1704332.
17 Li X H, Li X F, Liao K N, et al. ACS Applied Materials & Interfaces, 2016, 8, 33230.
18 Arjmand M, Mahmoodi M, Gelves G A, et al.Carbon, 2011, 49, 3430.
19 Bhattacharjee Y, Arief I, Bose S.Journal of Materials Chemistry C, 2017, 5, 7390.
20 Shen B, Li Y, Zhai W T, et al. ACS Applied Materials & Interfaces, 2016, 8, 8050. |
|
|
|
渝公网安备50019002502923号 © Editorial Office of Materials Reports.
2022, Vol. 36 
