导热绝缘聚合物复合材料的研究进展

Abstract
Figure/Table
References
Related Citation (4)

Download:

Full Text ( PDF ) (2733KB)
Export: BibTeX | EndNote (RIS)

Abstract Polymer composites with high thermal conductivity make effects to transfer heat to the outside of devices and greatly improve service life of electronic products. Thus, thermal conductive and electrical insulating polymer composites are widely used in electronic packaging, ultra-high voltage electronic devices, light-emitting diodes and other small integrated electronic devices. In this review, the classification, thermal me-chanism, thermal model and common thermal fillers of thermal polymer composites are briefly introduced, and the research progress and development trend of thermal conductive and electrical insulating polymer composites are summarized.

Key words： thermal conductivty and electrical insulation polymer composites thermally conductive mechanism thermally conductive fillers

Published: 16 July 2021

CLC number:

TB33

About author:: Kai Zhang received his B.E. degree in chemistry from Sun Yat-Sen University in 2012 and received his Ph.D. degree in polymer chemistry and physics from Sun Yat-Sen University, in 2017. Now he is an engineer at the research center of the Marine Chemical Research Institute Co., Ltd., and a postdoctoral fellow at the State Key Laboratory of Marine Coating. His research has focused on environmentally friendly marine antifouling coating.

	Service
	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	ZHANG Kai
	GUI Taijiang
	WU Lianfeng
	GUO Lisha
	GUO Lingmin

Cite this article:

ZHANG Kai,GUI Taijiang,WU Lianfeng, et al. Research Progress of Thermal Conductive and Electrical Insulating Polymer Composites[J]. Materials Reports, 2021, 35(Z1): 571-575.

URL:

http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2021/V35/IZ1/571

1 Isarn I, Bonnaud L, Massagués L, et al. Progress in Organic Coatings, 2019, 133, 299.
2 Yang X, Liang C, Ma T, et al. Advanced Composites and Hybrid Mate-rials, 2018, 1, 207.
3 Zhang T, Luo T. The Journal of Physical Chemistry B, 2016, 120, 803.
4 吕勇, 罗世永, 许文才. 北京印刷学院学报, 2008, 16(2), 76.
5 Wu K, Lei C, Huang R, et al. Applied Materials & Interfaces, 2017, 9, 7637.
6 Shtein M, Nadiv R, Buzaglo M, et al. Chemistry of Materials, 2015, 27, 2100.
7 Huang J C. Advances in Polymer Technology, 2002, 21(4), 299.
8 Gu J, Li N, Tian L, et al. RSC Advance, 2015, 5, 36334.
9 Kwon S Y, Kwon I M, Kim Y G, et al. Carbon, 2013, 55, 285.
10 Moniruzzanman M, Winey K I.Macomolecules, 2006, 39, 5194.
11 Chen H, Ginzburg V V, Yang J, et al.Progress in Polymer Science, 2016, 59, 41.
12 Zhang T, Wu X, Luo T.The Journal of Physical Chemistry C, 2014, 118(36), 21148.
13 冯伟, 李伟.炭素, 2017, 172(3), 5.
14 Hu Y, Du G, Chen N.Composites Science and Technology, 2016, 124, 36.
15 Jiang C, Zhang D, Gan X, et al.Ceramics Internation, 2014, 40, 2535.
16 Kim K, Ju H, Kim J.Composites Science and Technology, 2017, 141, 1.
17 Zhang L, Deng H, Fu Q.Composites Communications, 2018, 8, 74.
18 Chen C, Wang H, Xue Y, et al.Composites Science and Technology, 2016, 128, 207.
19 Yu J, Huang X, Wang L, et al.Polymer Chemistry, 2011, 2(6), 1380.
20 Hong J P, Yoon S W, Hwang T, et al. Thermochimica Acta, 2012, 537, 70.
21 Xu Y, Chung D D L.Composite Interfaces, 2012, (4), 243.
22 Isarn I, Massagués L, Ramis X, et al.Composites Part A: Applied Science and Manufacturing, 2017, 103, 35.
23 Peters J E, Papavassilious D V, Graydy B P.Macomolecules, 2008, 41(20), 7274.
24 Noma Y, Saga Y, Une N.Carbon, 2014, 78, 204.
25 Shan X, Liu Y, Wu Z, et al. In: 26th International Cryogenic Enginee-ring Conference & International Cryogenic Materials Conference. New Delhi, India. 2017, pp. 012151.
26 Bao R, Yan S, Qin Y, et al.Journal of Applied Polymer Science, 2016, 134(8), 44579.
27 李宾, 刘妍, 孙斌,等. 化工学报, 2009, 60(10), 2650.
28 Weidenfeller B, Höfer M, Schilling F R.Composites Part A: Applied Science and Manufacturing, 2004, 35(4), 423.
29 Wang Z, Lizuka T, Kozako M, et al.IEEE Transactions on Dielectrics and Electrical Insulation, 2011, 18(6), 1973.
30 Yuan C, Duan B, Li L, et al.ACS Applied Material & Interfaces, 2015, 7, 13000.
31 Wang Y, Yang C, Pei Q, et al.ACS Applied Material & Interfaces, 2016, 8(12), 8272.
32 Terao T, Bando Y, Mitome M, et al.The Journal of Physical Chemistry C 2009, 113(31), 13605.
33 Pashayi K, Fard H R, Lai F, et al.Nanoscale, 2014, 6(8), 4292.
34 Mu L, Ji T, Chen L, et al.ACS Applied Material & Interfaces, 2016, 8(42), 29080.
35 Mu L, Li Y, Mehra N, et al.ACS Applied Material & Interfaces, 2017, 9(13), 12138.
36 Agari Y, Ueda A, Nagai S.Journal of Applied Polymer Science, 1991, 42(6), 1665.