Materials Reports 2021, Vol. 35 Issue (Z1): 386-388 |
METALS AND METAL MATRIX COMPOSITES |
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Effects of Multi-wire Sawing Process on the Damage Layer and Geometric Parameters of the Single Crystal Germanium |
LI Cong, LI Zhiyuan, TAO Shuhe
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China Electronics Technology Group Corporation NO.46 Research Institute, Tianjin 300220, China |
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Abstract The research is concentrated on effects of the size of abrasive particles, feeding speed and the diameter of wire on the damage layer and geometric parameters of the single crystal germanium. The results show that the damage layer and the roughness increase with the size of abrasive particles during the sawing. The depth of damage layer reaches 6 μm and the roughness reaches 0.285 μm when use 3 000# abrasive particles during sawing;Temperature variation during sawing can be reduced by reducing the feeding speed which can reduce the geometric parameters of the germanium wafer; High quality surface, less geometric parameters and loss can be obtained by using 3 000# abrasive particles, feeding speed of 100 μm/min and wire of 0.09 mm in diameter.
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Published: 16 July 2021
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About author:: Cong Li, graduated from Northeastern University majoring in material engineering, master degree. Mainly engaged in silicon, germanium and other semiconductor substrate materials processing technology. |
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