Materials Reports  2019, Vol. 33 Issue (Z2): 428-430 |
| METALS AND METAL MATRIX COMPOSITES |
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| Effect of Chemical Etching on Mechanical Strength of Germanium Wafers |
| LYU Fei, TIAN Yuan, SONG Jing, YANG Chunying, LIU Xuesong
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| The 46th Research Institute, CETC, Tianjin 300220 |
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Abstract The mechanical strength of germanium wafers are affected by many factors, such as single crystal growth method and process. In the process of wafers manufacture, the strength of wafer varies with the processing method. The strength of germanium wafers after cutting and grinding is very low, but the strength increases greatly after chemical etching. Therefore, chemical etching becomes the key process affecting the mecha-nical strength of germanium wafers. In this paper, the mechanical strength of the germanium wafers was improved by studying the influence factors such as the composition, temperature and corrosion mode of the chemical etching liquid.
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Published: 25 November 2019
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About author:: Fei Lyu, female, born in 1967, senior engineer, the main research direction is semiconductor material processing.
Yuan Tian, male, born in 1989, engineer, the main research direction is semiconductor material processing. |
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WANG Pan, TONG Ling, ZHOU Zhiwen, YANG Jie, WANG Chong, CHEN Anran, WANG Rongfei, SUN Tao, YANG Yu. Progress in Fabrication of Silicon Nanowires by Metal-assisted Chemical Etching[J]. Materials Reports, 2019, 33(9): 1466-1474. |
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