废线路板非金属材料回收利用技术现状与展望

doi:10.11896/cldb.20060279

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Abstract In recent years, with the rapid development of science and technology and the continuous improvement of the standard of living, the demand for electronic and electrical equipment (EEE) continues to increase. With the improvement of the quality of life, electronic and electrical equipment, resulting in the continuous shortening of the life of electronic and electrical equipment, and the speed of upgrading with the improvement of life quality, people are gradually pursuing the multi-function and portability of EEE, which resulted in that the service life of EEE is shorten continually and the speed of replacement is accelerated. The number of waste electronic and electrical equipment (WEEE) in the world is growing at an alarming rate. The composition of WEEE is very complex containing a variety of metal elements and harmful substances, which make it be both an opportunity and a challenge for resource recovery and environmental protection. As the main component of WEEE, waste printed circuit boards (WPCBs), which contain a variety of metal elements whose content is higher than the corresponding mineral products, have high reco-very value. Due to the high economic value, the recycling of metal materials has attracted worldwide attention. Many researches have explored many efficient and environmental friendly methods to recycle metal materials. At present, the recycling technologies of metal materials have been very mature. However, the non-metal materials, which accounts for a large proportion in WPCBs, are often neglected due to the low economic value. The common recycling techniques of non-metal materials are incineration or landfill. The non-metal material contains heavy metals, brominated flame retardants and other harmful substances, toxic gases such as dioxins, polybrominated diphenyls and dibenzofurans would be produced during the incineration process. In addition, landfill will lead to secondary groundwater pollution because of the leaching of heavy metals and brominated flame retardants. With the increasing of environmental awareness, the recycling of non-metal materials has attracted more and more attention to avoid resources waste and environmental pollution. At present, a lot of researches have been done to recover non-metal mate-rials from WPCBs. At this paper, the technologies and current situation of non-metal materials recycling are elaborated based on the existing researches. And the future trend of non-metal materials recycling is also discussed. At present, the methods of non-metal materials recovery include physical recovery methods and chemical recovery methods, which could recover and utilize the non-metal materials effectively. The phy-sical methods use the separated non-metallic materials as fillers, raw materials or modifiers to produce thermosetting resin matrix composites and thermoplastic resin matrix composites, concrete and viscoelastic materials. These methods could change the properties of materials and reduce the production cost of the materials by replacing the original materials using non-metal materials. Chemical recovery methods mainly include pyrolysis, liquid depolymerization and hydrogenation degradation. Among them, the pyrolysis recovery method has received more attention than other methods. Much work needs to be done on the recovery of non-metal materials by liquid depolymerization and hydrogenation degradation. This paper summarizes and compares the advantages and problems of various methods based on cost and environmental impact. And a reference is provided for the future development trend of non-metal materials recycling.

Key words： waste printed circuit board non-metal material recycling

Published: 22 April 2021

CLC number:

X76

Fund:National Key Research and Development Program (2018YFC1902501, 2018YFC1903605).

About author:: Juanjuan Haoreceived her M.S. degree from Beijing University of Technology in 2018. She is currently pursuing her Ph.D. at the College of Materials Science and Engineering, Beijing University of Technology (BJUT) under the supervision of Prof. Fu Guo. Her research has focused on the recycling of precious metals from waste printed circuit boards (WPCBs).
Fu Guoobtained his Ph.D. degree from Michigan State University (MSU) in 2001 and served in College of Materials Science and Engineering, Beijing University of Technology (BJUT) from 2003 till now. He has published more than 200 journal papers. His team's research interests are advanced interconnection mate-rials in electronic packaging alloying and composite approach in lead-free solder development,reliability cha-racterization of solder joint,thermoelectric materials and so on. Now he serves as the vice secretary of China Materials Society Youth Committee, chair of the Manufacturing Technology Committee of Beijing Electronic Society, and the secretary of Electronic Packaging and Interconnect Materials Committee of TMS.

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Cite this article:

HAO Juanjuan,WANG Yishu,WU Yufeng, et al. Current Situation and Prospect of Recovery and Utilization of Non-metal Materials of Waste Printed Circuit Board[J]. Materials Reports, 2021, 35(7): 7001-7012.

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http://www.mater-rep.com/EN/10.11896/cldb.20060279 OR http://www.mater-rep.com/EN/Y2021/V35/I7/7001

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