2,2′-联吡啶对化学铜二元络合剂体系沉积过程的影响

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Abstract Compared with the single-ligand electroless copper system, the dual-ligands system was concerned about recently because it could increase the regulatory space for deposit reaction. 2,2′-dipyridyl as a stabilizer was used for electroless copper plating in EDTA/THPED dual-ligands system. The electrochemical behavior and surface structure of copper layer were studied systematically. Mixed potential tests indicated that the overall process was divided into three districts that called as induction, transitional and stable region, 2,2′-dipyridyl made fall-off trend of electrode potential to slowdown. 2,2′-dipyridyl could retard cathodic polarization by linear sweep voltammetry test, the peak value of cathodic current density decreased 34.3%, which reduced obviously Cu deposition rate due to cathodic reaction was control step. Meanwhile, the decomposition time of electroless solution sharply increased and the reoxidation of Cu(I) ion was effectively inhibited in the presence of 2,2′-dipyridyl. Metallographic studies of copper layers with 2,2′-dipyridyl revealed that surface structures and fine particle distribution were uniform. The resultant product was high-purity without detectable metal oxide. Moreover, copper layers displayed that addition of 2,2′-dipyridyl favored the formation of the preferred orientation on the (220) lattice plane by X-ray diffraction, which was related to the directional adsorption of the stabilizer, i.e. preferential adsorption on the (111) and (200) crystal planes. There was no significant change in grain size with the addition of 2,2′-dipyridyl.

Key words： 2,2′-dipyridyl electroless copper mixed potential preferred orientation directional adsorption

Published: 08 January 2021

CLC number:

TQ153.1

Fund:This work was supported by Changzhou Science & Technology Program(CJ20180014).

About author:: Jianhong Lu is a researcher. His research interest are electrochemistry of metallurgical process and functional materials. Shuqiang Jiao, professor. His research interest are electrochemistry of metallurgical process and enginee-ring, resources recycling, energy storage materials and devices.

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	LU Jianhong
	DENG Xiaomei
	YAN Jianhui
	TU Jiguo
	WANG Mingyong
	JIAO Shuqiang

Cite this article:

LU Jianhong,DENG Xiaomei,YAN Jianhui, et al. Deposition Effect of 2,2′-dipyridyl in Dual-ligands Electroless Copper System[J]. Materials Reports, 2020, 34(Z2): 539-542.

URL:

http://www.mater-rep.com/EN/ OR http://www.mater-rep.com/EN/Y2020/V34/IZ2/539

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