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Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics |
ZHANG Shuye
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State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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Abstract (a) APL ACFs fabrication process; (b) APL nanofibers cooperated with solders; (c) flex-on-flex interconnection using solder ACFs under bending test; (d) solder ACFs for flexible ultrasonic transducers; (e) ACFs used artificial skin electronics Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates[1]. Before that, flex-on-board (FOB) assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics, such as smart watches[2]. FOB is an alternative interconnection for the conventio-nal socket-type interconnection[3], by achieving a thinner package size, a higher electrical property, a fine-pitch capability and a higher long-term reliability[4]. Recently, for a higher reliability[5], solder particles have been applied in anisotropic conductive films (ACFs) to form micron-sized Sn joints. Compared with the polymer ball joints, 3 main advantages were introduced, such as lower resistance, higher reliability and higher power handling capability[6-8]. Therefore, the ACFs resin properties, silica filler contents, ultrasonic bonding & thermal compression bonding parameters have been developed and optimized for an entirely complete solder ACFs joint and a highly reliable FOB assembly.
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Published: 14 July 2020
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1 Liu Wei, et al. Advanced Materials, 2017,29,1603436. 2 Kiilunen Janne, Laura Frisk. Soldering & Surface Mount Technology, 2014,26(2), 62. 3 Neeb Christoph, et al. IEEE Industrial Electronics Magazine, 2014,8(3), 6. 4 Abhijit Kar, et al. Lead free solders. IntechOpen, UK,2019. 5 Kim Yoo-Sun, et al. Journal of the Microelectronics and Packaging Society, 2015,22(1), 35. 6 Zhang Shuye, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015,5(1),9. 7 Zhang Shuye, et al. Microelectronics Reliability, 2017,78, 181. 8 Zhang Shuye, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(3),383. 9 Song Lu, et al. IEEE Transactions on Components, Packaging and Ma-nufacturing Technology, 2020,10(3),368. 10 Park Jae-Hyeong, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(11),2152. 11 Kim Tae-Wan, et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(9),1317. 12 Zhang Shuye, et al. Journal of Materials Science: Materials in Electro-nics, 2019, 30(15),13855. 13 Miyamoto Akihito, et al. Nature Nanotechnology, 2017, 12(9),907. |
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